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SNJ54ABT18245AWD

Texas Instruments

SNJ54ABT18245AWD by Texas Instruments

SNJ54ABT18245AWD by Texas Instruments is a 9-bit bus driver with 5.4 ns propagation delay, suitable for military-grade applications. It features 3-STATE output characteristics, operates at temperatures from -55 to 125 °C, and has a max supply voltage of 5.5 V. Ideal for bidirectional data transmission in harsh environments requiring fast signal propagation.

Median Price

$111.300

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 324 parts In-Stock

1+ parts

$89.549

100+ parts

$86.856

1k+ parts

$67.330

10k+ parts

-

324

$89.549

$86.856

$67.330

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Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$111.300

1k+ parts

$99.590

10k+ parts

$93.730

7

-

$111.300

$99.590

$93.730

DigiKey

USA . 7 parts In-Stock

1+ parts

-

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7

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Verical

USA . 7 parts In-Stock

1+ parts

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$126.362

1k+ parts

$114.263

10k+ parts

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7

-

$126.362

$114.263

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,288 parts In-Stock

1+ parts

$85.072

100+ parts

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2,288

$85.072

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Vyrian

USA . 2,566 parts In-Stock

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2,566

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PC Components Company LLC

USA . 74 parts In-Stock

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Bristol Electronics

USA . 74 parts In-Stock

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74

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Sogenti Electronics

Canada . 20 parts In-Stock

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Electronics Depot

USA . 15 parts In-Stock

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15

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 143 parts In-Stock

1+ parts

$3.108

100+ parts

-

1k+ parts

$2.984

10k+ parts

$2.984

143

$3.108

-

$2.984

$2.984

Parana Technologies

USA . 457 parts In-Stock

1+ parts

$12.894

100+ parts

-

1k+ parts

$13.379

10k+ parts

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457

$12.894

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$13.379

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DigiPath Technology Company

USA . 1,055 parts In-Stock

1+ parts

$14.198

100+ parts

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1,055

$14.198

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ChromeModa Solutions

Germany . 6,034 parts In-Stock

1+ parts

$14.488

100+ parts

$11.880

1k+ parts

-

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6,034

$14.488

$11.880

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IDEA Electronic Components Group

UK . 2,197 parts In-Stock

1+ parts

$14.488

100+ parts

$13.764

1k+ parts

$13.039

10k+ parts

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2,197

$14.488

$13.764

$13.039

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Corphita

USA . 1,410 parts In-Stock

1+ parts

$80.594

100+ parts

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1,410

$80.594

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Microchip USA

USA . 1,825 parts In-Stock

1+ parts

$157.430

100+ parts

$154.690

1k+ parts

$153.320

10k+ parts

$151.950

1,825

$157.430

$154.690

$153.320

$151.950

Overview

Elevate your electronic designs with the SNJ54ABT18245AWD from Texas Instruments, a leading manufacturer known for top-quality components. This bus driver and transceiver offers unparalleled reliability and performance in various applications. With its advanced technology and military-grade screening level, this product ensures seamless data transmission and efficiency. Experience the value of fast propagation delay, low power consumption, and durable package body material. Trust in Texas Instruments to deliver cutting-edge solutions for all your design needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the components inside, ensuring longevity and reliability of the product.

Propagation Delay At Nominal Supply: 5.4 ns

Low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed data applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional components, saving costs and board space.

Screening Level: MIL-PRF-38535

This high screening level ensures reliability and quality, making it ideal for use in critical applications where performance is crucial.

Package Shape: RECTANGULAR

Rectangular package shape maximizes space efficiency on circuit boards, allowing for more components to be placed in a smaller area.

No. of Bits: 9

Having 9 bits allows for a wide range of data processing capabilities, making this product versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with many existing systems and simplifies power management.

Load Capacitance (CL): 50 pF

The low load capacitance improves signal integrity and reduces interference, ensuring more reliable data transmission.

Power Supplies (V): 5

Having a single 5V power supply simplifies the design and operation of the product, making it easier to integrate into existing systems.

No. of Terminals: 56

Having 56 terminals provides ample connectivity options, allowing for versatile and flexible circuit designs.

Package Style (Meter): FLATPACK

The flatpack package style saves space and allows for dense packing of components, making it suitable for applications with limited board space.

Maximum I (ol): 64 Amp

The high output current capability allows for driving of larger loads, making this product suitable for applications requiring high-power output.

Propagation Delay (tpd): 5.8 ns

Low propagation delay ensures fast signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows for reliable operation in harsh environments, making this product suitable for industrial and military applications.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, enabling bus sharing and reducing interference in multi-driver applications.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation in extreme cold conditions, making this product suitable for outdoor and automotive applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity of the product.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in board layout and allows for easier connections, improving the ease of assembly and maintenance.

No. of Ports: 2

Having 2 ports allows for simultaneous data transmission, increasing efficiency and throughput in multi-port applications.

Maximum Seated Height: 3.05 mm

The low seated height saves space on the circuit board, making this product suitable for compact and portable devices.

Width: 9.655 mm

Compact width dimensions allow for efficient space utilization on the circuit board, enabling dense packing of components in a limited area.

Output Polarity: TRUE

True output polarity ensures correct signal interpretation and compatibility with standard communication protocols, improving system interoperability.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement allows for operation in low-power environments, making this product suitable for battery-powered applications.

Length: 18.415 mm

Compact length dimensions save space on the circuit board, enabling efficient component arrangement and layout optimization.

Temperature Grade: MILITARY

MILITARY grade temperature rating ensures reliability and performance in harsh environments, making this product suitable for defense and aerospace applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high-speed performance and low power consumption for efficient operation.

Terminal Form: FLAT

Flat terminal form allows for easy soldering and reliable connections, ensuring secure attachment to the circuit board for stable operation.

Packing Method: TUBE

Tube packing method provides protection during shipping and storage, preventing damage and ensuring the product arrives in optimal condition.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for compact design and efficient use of space on the circuit board, enabling high-density packaging of components.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enables data transmission in both directions, increasing versatility and flexibility in communication systems.

Control Type: COMMON CONTROL

Common control type simplifies operation and coordination of multiple functions, improving efficiency and ease of use in complex systems.

Maximum Supply Voltage (Vsup): 5.5 V

Having a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources, enabling versatile and flexible deployment.

Maximum Power Supply Current (ICC): 38 mA

Low power supply current consumption reduces energy usage and heat generation, making this product energy-efficient and cost-effective to operate.

Technical Specifications

Bus Driver & Transceivers SNJ54ABT18245AWD attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-GDFP-F56

JESD-609 Code:

e0

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL56,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

3.05 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

9.655 mm

Trade Compliance

SNJ54ABT18245AWD Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-453-9536, 5962014539536

NIIN

014539536

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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