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SN74SSTU32866AZKER

Texas Instruments

SN74SSTU32866AZKER by Texas Instruments

SN74SSTU32866AZKER by Texas Instruments is a 25-bit TTL latch with 2.5 ns propagation delay, operating b/w 0-70°C. It features a low profile grid array package and is suitable for applications requiring fast signal triggering at a supply voltage range of 1.7-1.9V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,343 parts In-Stock

1+ parts

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8,343

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Digiode

USA . 2,739 parts In-Stock

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2,739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,341 parts In-Stock

1+ parts

$7.289

100+ parts

-

1k+ parts

$7.787

10k+ parts

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1,341

$7.289

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$7.787

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DigiPath Technology Company

USA . 1,608 parts In-Stock

1+ parts

$8.026

100+ parts

$7.384

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1,608

$8.026

$7.384

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IDEA Electronic Components Group

UK . 2,079 parts In-Stock

1+ parts

$8.190

100+ parts

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$7.371

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2,079

$8.190

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$7.371

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ChromeModa Solutions

Germany . 275 parts In-Stock

1+ parts

$8.190

100+ parts

$6.716

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275

$8.190

$6.716

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AZTECH Wire

Italy . 556 parts In-Stock

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$13.568

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556

$13.568

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One Stop Electronics

USA . 1,414 parts In-Stock

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$61.000

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1,414

$61.000

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Corphita

USA . 2,495 parts In-Stock

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2,495

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Microchip USA

USA . 342 parts In-Stock

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342

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Overview

Enhance your electronic designs with the SN74SSTU32866AZKER by Texas Instruments, a leading manufacturer in the industry. This high-quality latch and flip-flop device offers reliable performance and precision with its advanced technology. Ideal for a wide range of applications, this product ensures seamless operation and efficient functionality. Trust Texas Instruments to deliver value and innovation, providing customers with unparalleled benefits and advantages. Upgrade your projects today with the SN74SSTU32866AZKER and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material helps in reducing the overall weight of the product, making it easier to handle and install.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on circuit boards, saving time and effort during assembly.

No. of Bits: 25

With 25 bits, this latch & flip-flop product offers a higher level of functionality and options for data storage and manipulation.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V helps in reducing power consumption and heat generation, making it energy-efficient.

Propagation Delay (tpd): 2.5 ns

The low propagation delay of 2.5 ns ensures quick switching speeds, making this product suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand higher temperatures, increasing its durability.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures reliable and stable operation, making it suitable for applications where precision timing is crucial.

Width: 5.5 mm

The compact width of 5.5mm saves space on the circuit board, allowing for more components to be accommodated in a limited area.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of devices, making it versatile and easy to integrate into existing systems.

Technical Specifications

Latches & Flip-Flops SN74SSTU32866AZKER attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

SSTU

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

25

No. of Functions:

1

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Minimum fmax:

500 MHz

Trade Compliance

SN74SSTU32866AZKER Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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