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SN74S140N

Texas Instruments

SN74S140N by Texas Instruments

SN74S140N by Texas Instruments is a TTL logic gate with 2 functions and 4 inputs. It has a propagation delay of 6.5 ns at 5V, making it ideal for applications requiring fast signal processing in commercial temperature environments. The package is rectangular in shape, with through-hole terminals and a max power supply current of 44 mA.

Median Price

$2.375

Lifecycle Status

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60

In-Stock Inventory

1k+

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Chip1Stop

Japan . 18 parts In-Stock

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Mouser Electronics

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Verical

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Arrow

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Digiode

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First Choice Components Inc.

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Ack Elektronik San.Tic.Ltd.Sti

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Corphita

USA . 2,203 parts In-Stock

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Parana Technologies

USA . 1,348 parts In-Stock

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DigiPath Technology Company

USA . 1,549 parts In-Stock

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IDEA Electronic Components Group

UK . 739 parts In-Stock

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ChromeModa Solutions

Germany . 667 parts In-Stock

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A-Z Elektronik GmbH

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Perfect Parts

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Overview

Unlock the power of seamless logic integration with the SN74S140N by Texas Instruments. Crafted with precision and expertise, this logic gate offers unparalleled reliability and performance. Ideal for a wide range of applications, this high-quality product guarantees smooth operation and efficiency. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SN74S140N, providing customers with a top-tier solution for all their logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures fast response times, making this product suitable for high-speed applications.

No. of Functions: 2

Having multiple functions in a single component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

The standard 5V supply voltage makes compatibility with other components easy.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Technical Specifications

Logic Gates SN74S140N attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

IOL = 60MA @ VOL = 0.5V; IOH = 3MA @ VOH = 2.7V

Family:

S

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

60 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

44 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74S140N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-096-2165, 5962010962165, 5962-01-263-2887, 5962012632887

NIIN

010962165, 012632887

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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