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SN74LVTH32374ZKER

Texas Instruments

SN74LVTH32374ZKER by Texas Instruments

SN74LVTH32374ZKER by Texas Instruments is a 3-STATE bus driver with 8 bits and 4 functions. It operates at a max frequency of 160MHz, has a propagation delay of 5.2ns, and supports a load capacitance of 50pF. Ideal for industrial applications requiring independent control and positive edge triggering in a compact grid array package.

Median Price

$1.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

$1.390

10k+ parts

$1.300

5

-

$1.550

$1.390

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,122 parts In-Stock

1+ parts

$1.634

100+ parts

-

1k+ parts

-

10k+ parts

-

4,122

$1.634

-

-

-

Vyrian

USA . 3,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,011

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,783 parts In-Stock

1+ parts

$1.548

100+ parts

-

1k+ parts

-

10k+ parts

-

2,783

$1.548

-

-

-

Andel Nordic

Denmark . 1,380 parts In-Stock

1+ parts

$5.443

100+ parts

-

1k+ parts

$5.225

10k+ parts

$5.225

1,380

$5.443

-

$5.225

$5.225

Parana Technologies

USA . 2,123 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

$14.469

10k+ parts

-

2,123

$14.000

-

$14.469

-

AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$14.960

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$14.960

-

-

-

DigiPath Technology Company

USA . 1,328 parts In-Stock

1+ parts

$15.415

100+ parts

$14.182

1k+ parts

-

10k+ parts

-

1,328

$15.415

$14.182

-

-

ChromeModa Solutions

Germany . 3,197 parts In-Stock

1+ parts

$15.730

100+ parts

$12.899

1k+ parts

-

10k+ parts

-

3,197

$15.730

$12.899

-

-

IDEA Electronic Components Group

UK . 992 parts In-Stock

1+ parts

$15.730

100+ parts

$14.944

1k+ parts

$14.157

10k+ parts

-

992

$15.730

$14.944

$14.157

-

Microchip USA

USA . 106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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106

-

-

-

-

Overview

Unlock the power of seamless data transmission with the SN74LVTH32374ZKER by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. Ideal for a variety of applications, this product provides customers with lightning-fast propagation delay, low power consumption, and versatile functionality. Elevate your projects with the exceptional value, benefits, and advantages that only Texas Instruments can deliver. Trust in the SN74LVTH32374ZKER to exceed your expectations and propel your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast and efficient signal transmission.

Surface Mount: YES

Surface mount capability allows for easy integration into electronic circuits.

No. of Functions: 4

Provides multiple functions in a single component, saving space and simplifying design.

Package Shape: RECTANGULAR

Rectangular shape is easy to handle and fits well in standard electronic configurations.

No. of Bits: 8

8 bits offer a wide range of signal processing capabilities for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and stable supply voltage for compatibility with other components.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures efficient signal transmission and reception.

Power Supplies (V): 3.3

Consistent power supply voltage ensures reliable performance.

No. of Terminals: 96

Multiple terminals offer versatile connectivity options.

Technical Specifications

Bus Driver & Transceivers SN74LVTH32374ZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

160000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Trade Compliance

SN74LVTH32374ZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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