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SN74LVTH16501DLG4

Texas Instruments

SN74LVTH16501DLG4 by Texas Instruments

SN74LVTH16501DLG4 by Texas Instruments is an 18-bit bus driver with a propagation delay of 3.7 ns at 3.3V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85 °C) with independent control and positive edge trigger, suitable for bidirectional data transmission applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,548 parts In-Stock

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Digiode

USA . 3,935 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 210 parts In-Stock

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$11.960

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210

$11.960

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Parana Technologies

USA . 1,444 parts In-Stock

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$19.308

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$19.334

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DigiPath Technology Company

USA . 2,015 parts In-Stock

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$21.260

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$19.559

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$21.260

$19.559

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ChromeModa Solutions

Germany . 6,195 parts In-Stock

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$21.694

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$17.789

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$21.694

$17.789

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IDEA Electronic Components Group

UK . 395 parts In-Stock

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$21.694

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$20.609

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$19.525

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395

$21.694

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$19.525

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One Stop Electronics

USA . 397 parts In-Stock

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$57.000

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$57.000

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Andel Nordic

Denmark . 2,247 parts In-Stock

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$104.921

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$100.724

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$100.724

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$100.724

Corphita

USA . 2,161 parts In-Stock

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Microchip USA

USA . 2,117 parts In-Stock

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Overview

Enhance your electronic designs with the reliable SN74LVTH16501DLG4 by Texas Instruments, a leading manufacturer in the industry. This bus driver and transceiver offers fast propagation delay, versatile surface mount options, and high-quality output characteristics. Perfect for a wide range of applications, this product delivers exceptional performance and efficiency. Experience seamless operation with independent control and true output polarity, making it an invaluable addition to your projects. Upgrade your systems today with the superior quality and precision of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 3.7 ns

The low propagation delay ensures fast and efficient signal transmission, making the product suitable for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Bits: 18

With 18 bits, this product is capable of handling complex data transmission tasks accurately and efficiently.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF helps in stabilizing the signal transmission and reducing noise interference.

Power Supplies (V): 3.3

Consistent power supply of 3.3V ensures reliable performance of the product in various operating conditions.

No. of Terminals: 56

The high number of terminals allows for versatile connectivity options, making the product suitable for a wide range of applications.

Maximum I (ol): 64 Amp

The high maximum output current of 64 Amp ensures robust signal transmission capabilities, making the product suitable for demanding industrial environments.

Propagation Delay (tpd): 5.7 ns

Despite the slightly higher propagation delay, the product still offers fast and efficient signal transmission, making it suitable for high-speed data applications.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16501DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74LVTH16501DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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