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SN74LVTH16373ZRDR

Texas Instruments

SN74LVTH16373ZRDR by Texas Instruments

SN74LVTH16373ZRDR by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.8 ns and output characteristics in 3-STATE. It operates at a nominal voltage of 3.3V, suitable for industrial applications requiring fast signal transmission and low power consumption. The package style is grid array, thin profile, fine pitch, making it ideal for surface mount designs with limited space constraints.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,253 parts In-Stock

1+ parts

$1.260

100+ parts

$1.230

1k+ parts

$1.210

10k+ parts

-

3,253

$1.260

$1.230

$1.210

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Distributors (In-Stock)

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Vyrian

USA . 2,857 parts In-Stock

1+ parts

-

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2,857

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Digiode

USA . 1,871 parts In-Stock

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1,871

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Prism Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$10.933

100+ parts

-

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274

$10.933

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One Stop Electronics

USA . 879 parts In-Stock

1+ parts

$16.000

100+ parts

-

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879

$16.000

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Parana Technologies

USA . 1,684 parts In-Stock

1+ parts

$25.364

100+ parts

$2,355.442

1k+ parts

$22.828

10k+ parts

-

1,684

$25.364

$2,355.442

$22.828

-

DigiPath Technology Company

USA . 158 parts In-Stock

1+ parts

$27.929

100+ parts

$25.695

1k+ parts

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158

$27.929

$25.695

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IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$28.499

100+ parts

$27.074

1k+ parts

$25.649

10k+ parts

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1,305

$28.499

$27.074

$25.649

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ChromeModa Solutions

Germany . 1,194 parts In-Stock

1+ parts

$28.499

100+ parts

$23.369

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1,194

$28.499

$23.369

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Andel Nordic

Denmark . 1,730 parts In-Stock

1+ parts

$522.700

100+ parts

-

1k+ parts

$501.792

10k+ parts

$501.792

1,730

$522.700

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$501.792

$501.792

QUARKTWIN TECHNOLOGY LTD

USA . 9,606 parts In-Stock

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9,606

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Perfect Parts

USA . 6,950 parts In-Stock

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Corphita

USA . 4,571 parts In-Stock

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4,571

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Metaverse IC Inc.

Canada . 3,471 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 487 parts In-Stock

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487

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Overview

Unlock seamless communication and data transfer with the SN74LVTH16373ZRDR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that guarantee reliable performance. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. Experience fast propagation delay, efficient power consumption, and versatile design with the SN74LVTH16373ZRDR. Upgrade your electronics with this cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 3.8 ns

The low propagation delay ensures fast and efficient data transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

The surface-mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device provides versatility and flexibility in designing and implementing different bus driver and transceiver applications.

Nominal Supply Voltage/Vsup (V): 3.3

The compatibility with a common supply voltage of 3.3V allows for easy integration with existing systems and components.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in maintaining signal integrity and minimizing signal distortion during data transmission.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the product can withstand harsh environmental conditions, increasing its reliability and longevity.

Minimum Operating Temperature: -40 °C

The product can operate in extreme cold temperatures, ensuring reliability in a wide range of operating conditions.

Technology: BICMOS

The use of BICMOS technology combines the benefits of both bipolar and CMOS technologies, providing high-speed performance and low power consumption.

Terminal Pitch: 0.8 mm

The narrow terminal pitch allows for more terminals to be packed in a smaller space, increasing the product's functionality and versatility.

Technical Specifications

Bus Driver & Transceivers SN74LVTH16373ZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

4.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVTH16373ZRDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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