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SN74LVT32244GKER

Texas Instruments

SN74LVT32244GKER by Texas Instruments

SN74LVT32244GKER by Texas Instruments is an 8-bit bus driver with 3.2 ns propagation delay at 3.3V, suitable for industrial applications. It features a low profile grid array package with 96 terminals and operates b/w -40 to 85°C temperature range. With true output polarity and enable low control type, it offers reliable signal transmission in various electronic systems.

Median Price

$3.836

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,881 parts In-Stock

1+ parts

-

100+ parts

$3.410

1k+ parts

$3.050

10k+ parts

$2.870

7,881

-

$3.410

$3.050

$2.870

Verical

USA . 6,881 parts In-Stock

1+ parts

-

100+ parts

$4.263

1k+ parts

$3.813

10k+ parts

$3.587

6,881

-

$4.263

$3.813

$3.587

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,126 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

4,126

$3.600

-

-

-

DigiKey Marketplace

USA . 7,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,881

-

-

-

-

Vyrian

USA . 2,302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,302

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,381 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

-

10k+ parts

-

4,381

$3.411

-

-

-

Andel Nordic

Denmark . 1,468 parts In-Stock

1+ parts

$10.355

100+ parts

-

1k+ parts

$9.941

10k+ parts

$9.941

1,468

$10.355

-

$9.941

$9.941

Parana Technologies

USA . 1,621 parts In-Stock

1+ parts

$13.797

100+ parts

-

1k+ parts

$14.283

10k+ parts

-

1,621

$13.797

-

$14.283

-

DigiPath Technology Company

USA . 861 parts In-Stock

1+ parts

$15.192

100+ parts

-

1k+ parts

-

10k+ parts

-

861

$15.192

-

-

-

ChromeModa Solutions

Germany . 6,358 parts In-Stock

1+ parts

$15.502

100+ parts

$12.712

1k+ parts

-

10k+ parts

-

6,358

$15.502

$12.712

-

-

IDEA Electronic Components Group

UK . 550 parts In-Stock

1+ parts

$15.502

100+ parts

$14.727

1k+ parts

$13.952

10k+ parts

-

550

$15.502

$14.727

$13.952

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$19.977

100+ parts

$18.179

1k+ parts

$16.381

10k+ parts

-

500

$19.977

$18.179

$16.381

-

Microchip USA

USA . 294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

294

-

-

-

-

Overview

Unleash the power of reliable data transmission with the SN74LVT32244GKER by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Bus Drivers & Transceivers that are essential for seamless communication in various applications. With a focus on innovation and durability, this product offers customers unmatched value and performance. Say goodbye to delays and errors with the fast propagation delay and 3-STATE output characteristics. Trust Texas Instruments to provide you with the tools you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the bus driver & transceivers.

Propagation Delay At Nominal Supply: 3.2 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, saving valuable space and simplifying the assembly process.

No. of Functions: 8

With 8 functions integrated into one component, this bus driver & transceivers product offers a cost-effective solution for managing multiple signals and data streams.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes this product compatible with standard power sources, ensuring reliable performance in various electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal distortion and improving signal integrity, making this product ideal for high-frequency applications.

Technology: BICMOS

The BICMOS technology offers a combination of bipolar and CMOS characteristics, providing high-speed performance with low power consumption for energy-efficient operation.

Technical Specifications

Bus Driver & Transceivers SN74LVT32244GKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

4

No. of Functions:

8

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

3.2 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVT32244GKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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