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SN74LVCZ240ADBRE4

Texas Instruments

SN74LVCZ240ADBRE4 by Texas Instruments

SN74LVCZ240ADBRE4 by Texas Instruments is a 20-terminal bus driver with 2 functions, featuring a propagation delay of 6.5 ns and operating voltage of 3.3 V. It is used in industrial applications requiring a small outline package with inverted output polarity and enable low control type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,181 parts In-Stock

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Digiode

USA . 1,308 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,250 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 516 parts In-Stock

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$18.491

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516

$18.491

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Parana Technologies

USA . 259 parts In-Stock

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$25.362

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$25.986

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259

$25.362

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DigiPath Technology Company

USA . 1,665 parts In-Stock

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$27.927

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$25.693

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1,665

$27.927

$25.693

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ChromeModa Solutions

Germany . 1,345 parts In-Stock

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$28.497

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$23.368

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$28.497

$23.368

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IDEA Electronic Components Group

UK . 1,286 parts In-Stock

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$28.497

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$27.072

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$25.647

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1,286

$28.497

$27.072

$25.647

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Component Stockers USA

USA . 416 parts In-Stock

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$99.990

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Andel Nordic

Denmark . 1,328 parts In-Stock

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$310.228

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$297.819

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$297.819

1,328

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$297.819

Microchip USA

USA . 273 parts In-Stock

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Corphita

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Overview

Enhance your electronic projects with the SN74LVCZ240ADBRE4 by Texas Instruments, a top-quality bus driver & transceiver that promises reliability and performance. With Texas Instruments' reputation for excellence, this product offers unmatched value and benefits to customers seeking seamless data transmission. Ideal for various applications, this compact device boasts a fast propagation delay of 6.5ns and features 3-state output characteristics, making it perfect for industrial use. Upgrade your projects today with the SN74LVCZ240ADBRE4 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and lightweight, ideal for transportation and usage in various environments.

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay ensures fast data transmission and efficient operation of the bus driver & transceivers.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V allows compatibility with a wide range of systems and components.

Maximum Seated Height: 2 mm

Low seated height helps in compact design and integration of the product into tight spaces or densely populated circuit boards.

Technical Specifications

Bus Driver & Transceivers SN74LVCZ240ADBRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LVCZ240ADBRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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