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SN74LVCH32373AZKER

Texas Instruments

SN74LVCH32373AZKER by Texas Instruments

SN74LVCH32373AZKER by Texas Instruments is an 8-bit bus driver with 4 functions, featuring a propagation delay of 5.3 ns and output characteristics in 3-STATE. It operates at a nominal voltage of 1.8V and is ideal for industrial applications requiring low-profile, fine-pitch components with true output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,964 parts In-Stock

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4,964

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Chip Stock

USA . 3,345 parts In-Stock

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3,345

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Bristol Electronics

USA . 3,000 parts In-Stock

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3,000

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Digiode

USA . 1,112 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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870

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LWI Electronics Inc

India . 7 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 394 parts In-Stock

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$6.000

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394

$6.000

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Andel Nordic

Denmark . 3,979 parts In-Stock

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$6.512

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$6.252

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$6.252

3,979

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$6.252

$6.252

AZTECH Wire

Italy . 772 parts In-Stock

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$8.862

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Parana Technologies

USA . 1,313 parts In-Stock

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$11.269

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$11.703

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$11.703

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DigiPath Technology Company

USA . 2,081 parts In-Stock

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$12.409

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$11.416

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$12.409

$11.416

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ChromeModa Solutions

Germany . 859 parts In-Stock

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$12.662

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$10.383

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859

$12.662

$10.383

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IDEA Electronic Components Group

UK . 563 parts In-Stock

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$12.662

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$12.029

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$11.396

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563

$12.662

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$11.396

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Semicontronic

India . 847 parts In-Stock

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$14.000

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$13.650

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$13.580

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847

$14.000

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$13.580

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One Stop Electronics

USA . 1,022 parts In-Stock

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$23.000

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Lixinc

USA . 14,864 parts In-Stock

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Continental Prestige Electronics

USA . 3,905 parts In-Stock

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Perfect Parts

USA . 3,554 parts In-Stock

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Argo Parts USA

USA . 3,087 parts In-Stock

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Microchip USA

USA . 375 parts In-Stock

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Corphita

USA . 58 parts In-Stock

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Bastille Electronics

Australia . 19 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 16 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LVCH32373AZKER by Texas Instruments, a top-quality bus driver and transceiver designed to deliver unmatched performance. Texas Instruments is renowned for its innovative technology and reliable products, ensuring that this component meets the highest standards of excellence. Ideal for a wide range of applications, this product offers customers incredible value with its fast propagation delay, low power consumption, and versatile functionality. Upgrade your designs today with the SN74LVCH32373AZKER and experience the superior quality and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast and efficient data transmission, critical for real-time applications in buses.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional parts, saving space and simplifying the design.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage helps in reducing power consumption and heat generation, ideal for automotive applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this bus driver can withstand harsh environmental conditions inside a vehicle.

Technical Specifications

Bus Driver & Transceivers SN74LVCH32373AZKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BUS HOLD INPUTS ELIMINATE THE NEED FOR EXTERNAL PULLUP/PULLDOWN RESISTORS

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

5.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVCH32373AZKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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