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SN74LVCH245ARGYR

Texas Instruments

SN74LVCH245ARGYR by Texas Instruments

SN74LVCH245ARGYR by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.3 ns at 1.8V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and surface mount capability in a rectangular package style.

Median Price

$0.247

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 89,455 parts In-Stock

1+ parts

$0.247

100+ parts

$0.168

1k+ parts

$0.086

10k+ parts

-

89,455

$0.247

$0.168

$0.086

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,920 parts In-Stock

1+ parts

$0.235

100+ parts

-

1k+ parts

-

10k+ parts

-

3,920

$0.235

-

-

-

Vyrian

USA . 4,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,428

-

-

-

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Sensible Micro Corp

USA . 3,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,570

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-

-

-

Chip Stock

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,900

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,993 parts In-Stock

1+ parts

$0.222

100+ parts

-

1k+ parts

-

10k+ parts

-

2,993

$0.222

-

-

-

Ampacity Inc.

Singapore . 89,198 parts In-Stock

1+ parts

$0.457

100+ parts

-

1k+ parts

-

10k+ parts

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89,198

$0.457

-

-

-

Andel Nordic

Denmark . 372 parts In-Stock

1+ parts

$6.787

100+ parts

-

1k+ parts

$6.516

10k+ parts

$6.516

372

$6.787

-

$6.516

$6.516

AZTECH Wire

Italy . 1,017 parts In-Stock

1+ parts

$8.670

100+ parts

-

1k+ parts

-

10k+ parts

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1,017

$8.670

-

-

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Parana Technologies

USA . 2,100 parts In-Stock

1+ parts

$18.431

100+ parts

-

1k+ parts

$18.551

10k+ parts

-

2,100

$18.431

-

$18.551

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DigiPath Technology Company

USA . 117 parts In-Stock

1+ parts

$20.295

100+ parts

$18.671

1k+ parts

-

10k+ parts

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117

$20.295

$18.671

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-

ChromeModa Solutions

Germany . 1,902 parts In-Stock

1+ parts

$20.709

100+ parts

$16.981

1k+ parts

-

10k+ parts

-

1,902

$20.709

$16.981

-

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$20.709

100+ parts

$19.674

1k+ parts

$18.638

10k+ parts

-

1,283

$20.709

$19.674

$18.638

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Infinite Electronics LLP (Excess)

. 2,878 parts In-Stock

1+ parts

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100+ parts

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2,878

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Overview

Unlock seamless data transmission and reliable performance with the SN74LVCH245ARGYR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovation in the Bus Driver & Transceivers category. Ideal for a wide range of applications, this chip carrier with very thin profile is designed to provide exceptional value and benefits to customers. Say goodbye to communication bottlenecks and trust Texas Instruments for superior products that enhance efficiency and productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast and efficient signal transmission within the bus driver & transceivers.

Surface Mount: YES

Easy installation and space-saving design due to surface mount capability.

Nominal Supply Voltage / Vsup (V): 1.8

Efficient power consumption at a moderate voltage level of 1.8V.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Technical Specifications

Bus Driver & Transceivers SN74LVCH245ARGYR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20/24,.14X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

3.5 mm

Trade Compliance

SN74LVCH245ARGYR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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