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SN74LVCH16374ADGG

Texas Instruments

SN74LVCH16374ADGG by Texas Instruments

SN74LVCH16374ADGG by Texas Instruments is an 8-bit bus driver with 3-STATE output characteristics. It operates at a nominal voltage of 3.3V and has a propagation delay of 6.5ns, making it suitable for automotive applications requiring fast signal transmission in compact spaces. With a max operating temperature of 125°C and small outline package style, this CMOS technology-based transceiver offers reliable performance in harsh environments.

Median Price

$1.075

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,786 parts In-Stock

1+ parts

$1.040

100+ parts

$0.800

1k+ parts

$0.421

10k+ parts

-

25,786

$1.040

$0.800

$0.421

-

Rochester

USA . 1,720 parts In-Stock

1+ parts

-

100+ parts

$1.110

1k+ parts

$0.921

10k+ parts

$0.821

1,720

-

$1.110

$0.921

$0.821

DigiKey

USA . 1,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.390

10k+ parts

-

1,720

-

-

$1.390

-

Verical

USA . 1,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.919

10k+ parts

$0.820

1,640

-

-

$0.919

$0.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,898 parts In-Stock

1+ parts

$0.556

100+ parts

-

1k+ parts

-

10k+ parts

-

1,898

$0.556

-

-

-

Vyrian

USA . 6,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,822

-

-

-

-

Chip Stock

USA . 3,329 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,329

-

-

-

-

DigiKey Marketplace

USA . 3,240 parts In-Stock

1+ parts

-

100+ parts

$0.610

1k+ parts

-

10k+ parts

-

3,240

-

$0.610

-

-

PC Components Company LLC

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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35

-

-

-

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Bristol Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,065 parts In-Stock

1+ parts

$0.526

100+ parts

-

1k+ parts

-

10k+ parts

-

2,065

$0.526

-

-

-

Component Stockers USA

USA . 3,362 parts In-Stock

1+ parts

$0.600

100+ parts

$0.560

1k+ parts

$0.510

10k+ parts

-

3,362

$0.600

$0.560

$0.510

-

Andel Nordic

Denmark . 3,073 parts In-Stock

1+ parts

$5.332

100+ parts

-

1k+ parts

$5.119

10k+ parts

$5.119

3,073

$5.332

-

$5.119

$5.119

Parana Technologies

USA . 227 parts In-Stock

1+ parts

$20.821

100+ parts

-

1k+ parts

$20.988

10k+ parts

-

227

$20.821

-

$20.988

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DigiPath Technology Company

USA . 2,063 parts In-Stock

1+ parts

$22.926

100+ parts

$21.092

1k+ parts

-

10k+ parts

-

2,063

$22.926

$21.092

-

-

ChromeModa Solutions

Germany . 2,707 parts In-Stock

1+ parts

$23.394

100+ parts

$19.183

1k+ parts

-

10k+ parts

-

2,707

$23.394

$19.183

-

-

IDEA Electronic Components Group

UK . 1,076 parts In-Stock

1+ parts

$23.394

100+ parts

$22.224

1k+ parts

$21.055

10k+ parts

-

1,076

$23.394

$22.224

$21.055

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Kepictronics

USA . 2,974 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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2,974

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-

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Perfect Parts

USA . 118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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118

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Overview

Upgrade your electronic designs with the SN74LVCH16374ADGG from Texas Instruments, a top-quality bus driver and transceiver that offers unmatched reliability and performance. With a compact design and advanced technology, this product is ideal for a wide range of applications in automotive and industrial environments. Trust Texas Instruments to deliver cutting-edge solutions that bring value and efficiency to your projects. Experience the difference with the SN74LVCH16374ADGG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, ensuring a long lifespan.

No. of Bits: 8

Offers a wide range of functionality and versatility for handling data transmission.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage level ensures compatibility with various systems and applications.

Maximum I (ol): 24 Amp

High current handling capability allows for efficient power distribution and control.

Propagation Delay (tpd): 6.5 ns

Fast signal propagation ensures quick data transmission and response times.

Temperature Grade: AUTOMOTIVE

Suitable for use in automotive applications, providing reliability in harsh operating environments.

Technical Specifications

Bus Driver & Transceivers SN74LVCH16374ADGG attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay (tpd):

6.5 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN74LVCH16374ADGG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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