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SN74LVC646ADWG4

Texas Instruments

SN74LVC646ADWG4 by Texas Instruments

SN74LVC646ADWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.4 ns at 1.8V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and independent control for bidirectional data transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,826 parts In-Stock

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Digiode

USA . 1,422 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 600 parts In-Stock

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$3.000

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600

$3.000

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Andel Nordic

Denmark . 437 parts In-Stock

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$8.352

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$8.018

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$8.018

437

$8.352

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$8.018

$8.018

Parana Technologies

USA . 1,259 parts In-Stock

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$15.515

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$15.890

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$15.515

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$15.890

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DigiPath Technology Company

USA . 315 parts In-Stock

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$17.084

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315

$17.084

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ChromeModa Solutions

Germany . 3,102 parts In-Stock

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$17.433

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$14.295

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3,102

$17.433

$14.295

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IDEA Electronic Components Group

UK . 516 parts In-Stock

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$17.433

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$16.561

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$15.690

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516

$17.433

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$15.690

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AZTECH Wire

Italy . 731 parts In-Stock

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$18.716

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Microchip USA

USA . 1,942 parts In-Stock

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Corphita

USA . 1,412 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the SN74LVC646ADWG4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver ensures reliable performance in a wide range of applications. Its innovative design and top-notch quality make it a must-have for any project requiring efficient signal control. Experience unparalleled value and benefits with this product, delivering fast propagation delays and 3-state output characteristics. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations. Elevate your projects with the SN74LVC646ADWG4 and streamline your data communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 7.4 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and facilitating automated assembly.

No. of Bits: 8

Offers a sufficient number of bits for data transmission, making this product suitable for various bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement helps in minimizing power consumption and heat dissipation, contributing to energy efficiency.

Output Characteristics: 3-STATE

3-state output allows for multiple devices to share a bus line without causing conflicts, increasing the versatility of the product.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring performance in harsh environmental conditions.

Terminal Form: GULL WING

Gull wing terminals provide secure attachment to the circuit board, enhancing reliability and ease of soldering during assembly.

Maximum Supply Voltage (Vsup): 3.6 V

Can operate within a wide range of supply voltages, offering flexibility in various system designs and configurations.

Technical Specifications

Bus Driver & Transceivers SN74LVC646ADWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.4 ns

Propagation Delay (tpd):

8.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74LVC646ADWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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