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SN74LVC373AQDWREP

Texas Instruments

SN74LVC373AQDWREP by Texas Instruments

SN74LVC373AQDWREP by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.5 ns at 3.3V, suitable for automotive applications. It features a small outline package, operates b/w -40 to 125°C, and has a terminal pitch of 1.27 mm for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,040 parts In-Stock

1+ parts

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8,040

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Digiode

USA . 4,811 parts In-Stock

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4,811

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Distributors (Availability)

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One Stop Electronics

USA . 678 parts In-Stock

1+ parts

$7.000

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678

$7.000

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Andel Nordic

Denmark . 2,750 parts In-Stock

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$9.214

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$8.845

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$8.845

2,750

$9.214

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$8.845

$8.845

AZTECH Wire

Italy . 706 parts In-Stock

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$15.329

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706

$15.329

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Parana Technologies

USA . 1,646 parts In-Stock

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$24.094

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$24.746

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1,646

$24.094

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$24.746

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DigiPath Technology Company

USA . 847 parts In-Stock

1+ parts

$26.531

100+ parts

$24.408

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847

$26.531

$24.408

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IDEA Electronic Components Group

UK . 2,204 parts In-Stock

1+ parts

$27.072

100+ parts

$25.718

1k+ parts

$24.365

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2,204

$27.072

$25.718

$24.365

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ChromeModa Solutions

Germany . 1,008 parts In-Stock

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$27.072

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$22.199

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$27.072

$22.199

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Corphita

USA . 900 parts In-Stock

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900

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Microchip USA

USA . 261 parts In-Stock

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Overview

Upgrade your electronics with the SN74LVC373AQDWREP by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch Bus Driver & Transceivers like this one that provides reliable performance and superior quality. This versatile product is ideal for a wide range of applications, offering customers value, efficiency, and convenience. With its advanced features and durable construction, the SN74LVC373AQDWREP is sure to exceed your expectations and enhance your projects. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it suitable for automotive applications.

Propagation Delay At Nominal Supply: 7.5 ns

The low propagation delay ensures fast signal transmission, which is essential for bus driver & transceiver applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V is within the typical operating range for many electronic devices, offering compatibility and versatility.

Power Supplies (V): 3.3

The 3.3V power supply is a common standard voltage level in many electronic systems, ensuring compatibility with various applications.

Output Characteristics: 3-STATE

The 3-state output feature allows for high impedance, which is useful in bus driver applications for managing bus contention and preventing bus conflicts.

Temperature Grade: AUTOMOTIVE

The automotive grade temperature range (-40 to 125°C) ensures reliable operation in harsh automotive environments, making it suitable for automotive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it ideal for use in bus driver and transceiver circuits.

Technical Specifications

Bus Driver & Transceivers SN74LVC373AQDWREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74LVC373AQDWREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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