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SN74LVC32AMPWREPG4

Texas Instruments

SN74LVC32AMPWREPG4 by Texas Instruments

SN74LVC32AMPWREPG4 by Texas Instruments is a Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 3.8 ns at 3.3V, making it suitable for high-speed applications. With a small outline package style and MILITARY temperature grade, it is ideal for compact and rugged electronic systems.

Median Price

$3.550

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 659 parts In-Stock

1+ parts

$3.550

100+ parts

$1.880

1k+ parts

$1.280

10k+ parts

$1.040

659

$3.550

$1.880

$1.280

$1.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,628 parts In-Stock

1+ parts

$1.843

100+ parts

-

1k+ parts

-

10k+ parts

-

3,628

$1.843

-

-

-

Vyrian

USA . 4,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,416

-

-

-

-

Odi Ramu Company

Canada . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

489

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,614 parts In-Stock

1+ parts

$1.746

100+ parts

-

1k+ parts

-

10k+ parts

-

3,614

$1.746

-

-

-

Parana Technologies

USA . 1,225 parts In-Stock

1+ parts

$18.313

100+ parts

-

1k+ parts

$18.445

10k+ parts

-

1,225

$18.313

-

$18.445

-

IDEA Electronic Components Group

UK . 1,111 parts In-Stock

1+ parts

$20.576

100+ parts

$19.547

1k+ parts

$18.518

10k+ parts

-

1,111

$20.576

$19.547

$18.518

-

ChromeModa Solutions

Germany . 787 parts In-Stock

1+ parts

$20.576

100+ parts

$16.872

1k+ parts

-

10k+ parts

-

787

$20.576

$16.872

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-

Microchip USA

USA . 3,960 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,960

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DigiPath Technology Company

USA . 1,465 parts In-Stock

1+ parts

-

100+ parts

$18.551

1k+ parts

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10k+ parts

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1,465

-

$18.551

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Perfect Parts

USA . 325 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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325

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Overview

Unlock the power of innovative technology with the SN74LVC32AMPWREPG4 by Texas Instruments. This high-quality logic gate offers unparalleled performance and reliability, making it the perfect solution for a wide range of applications. From consumer electronics to industrial automation, this product delivers exceptional value, efficiency, and precision. Trust Texas Instruments to provide cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the SN74LVC32AMPWREPG4 and experience the difference that superior quality and craftsmanship can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it easy to handle and resistant to damage during handling and installation.

Propagation Delay At Nominal Supply: 3.8 ns

The low propagation delay ensures fast response times, making this logic gate suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and enabling automated assembly processes.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying circuit design and saving space.

No. of Inputs: 2

With 2 input ports, this logic gate can perform various logical operations, providing flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 2.7

The nominal supply voltage of 2.7V is within a common range, making it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal degradation and improving signal integrity, especially in high-frequency applications.

Power Supplies (V): 3.3

Operates at a standard power supply voltage of 3.3V, making it compatible with many digital circuits and power sources.

No. of Terminals: 14

With 14 terminals, this logic gate can connect to multiple other components and devices, enabling versatile circuit designs.

Maximum I (ol): 24 Amp

The high output current capability of 24A allows this logic gate to drive power-hungry components and circuits without the need for additional amplification.

Maximum Operating Temperature: 125 °C

With a high operating temperature range of up to 125°C, this logic gate can withstand harsh environmental conditions and extreme temperatures.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures reliable operation even in cold environments or during startup.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm allows for a compact and slim design, saving space in tight layouts and enabling thinner devices.

Width: 4.4 mm

The narrow width of 4.4mm makes this logic gate suitable for compact circuit designs and applications with space constraints.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V ensures compatibility with lower voltage systems and power sources, allowing for versatile applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this logic gate is easy to solder and integrate into assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and mounting, contributing to the reliability of the device in operation.

Length: 5 mm

The compact length of 5mm makes this logic gate suitable for space-constrained applications and designs where size is a critical factor.

Technology: CMOS

The CMOS technology used in this logic gate offers low power consumption, high noise immunity, and fast switching speeds, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring a secure and reliable connection.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65mm allows for dense packing and fine pitch mounting on circuit boards, optimizing space utilization.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with higher voltage systems and power sources, expanding the range of potential applications.

Maximum Power Supply Current (ICC): 0.01 mA

With a maximum power supply current of 0.01mA, this logic gate operates efficiently and consumes minimal power, reducing energy costs and heat generation.

Technical Specifications

Logic Gates SN74LVC32AMPWREPG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.8 ns

Propagation Delay (tpd):

4.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LVC32AMPWREPG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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