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SN74LVC32373AGKER

Texas Instruments

SN74LVC32373AGKER by Texas Instruments

SN74LVC32373AGKER by Texas Instruments is an 8-bit bus driver with 4 functions, featuring a propagation delay of 4.2 ns and operating voltage of 3.3 V. Ideal for industrial applications, it offers a low profile grid array package with true output polarity and 3-state characteristics.

Median Price

$2.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 20 parts In-Stock

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$2.620

100+ parts

$2.570

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$2.520

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$2.620

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Digiode

USA . 1,469 parts In-Stock

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Vyrian

USA . 1,345 parts In-Stock

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Nova Conductors

Japan . 53 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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One Stop Electronics

USA . 146 parts In-Stock

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$9.000

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Ampacity Inc.

Singapore . 821 parts In-Stock

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$13.000

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AZTECH Wire

Italy . 576 parts In-Stock

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$15.534

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Parana Technologies

USA . 384 parts In-Stock

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$29.512

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$60.187

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DigiPath Technology Company

USA . 894 parts In-Stock

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$32.497

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$29.897

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ChromeModa Solutions

Germany . 3,837 parts In-Stock

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$33.160

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$27.191

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$27.191

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

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$33.160

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$31.502

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$29.844

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$29.844

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Andel Nordic

Denmark . 66 parts In-Stock

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$55.272

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$53.061

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$53.061

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$53.061

QUARKTWIN TECHNOLOGY LTD

USA . 11,338 parts In-Stock

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Corphita

USA . 2,146 parts In-Stock

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Microchip USA

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Aranea Global

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Overview

Elevate your electronic designs with the SN74LVC32373AGKER by Texas Instruments, a top-notch bus driver & transceiver that delivers unparalleled quality and performance. With Texas Instruments' reputation for excellence in manufacturing, this product offers reliability and precision for a wide range of applications. Experience lightning-fast data transfer speeds and seamless connectivity with its 3-STATE output characteristics, true output polarity, and enable control type. Trust Texas Instruments to provide cutting-edge technology that meets the highest industrial standards, setting your projects apart from the rest. Unleash the power of the SN74LVC32373AGKER and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to external elements, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 4.2 ns

The low propagation delay ensures fast and efficient signal transmission, making this product ideal for high-speed data communication.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the circuit board, making it a convenient choice for compact designs.

No. of Functions: 4

Having multiple functions integrated into one component simplifies the circuit design, reduces the number of external components needed, and improves overall system efficiency.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and alignment on the circuit board, ensuring a secure and stable connection.

No. of Bits: 8

The 8-bit configuration provides a wide range of data processing capabilities, making this product suitable for applications that require handling large amounts of data.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage reduces power consumption and heat generation, making the product energy-efficient and cost-effective to operate.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and reliable signal transmission, making this product suitable for applications that require high signal integrity.

Power Supplies (V): 3.3

The 3.3V power supply allows compatibility with standard operating voltages, making it easy to integrate this product into existing systems.

No. of Terminals: 96

Having 96 terminals provides multiple connection points, increasing flexibility in circuit design and allowing for more complex applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design optimizes space utilization on the circuit board, making this product suitable for compact and densely populated layouts.

Maximum I (ol): 24 Amp

The high maximum output current rating allows the product to drive heavy loads without risk of damage, making it reliable for demanding applications.

Propagation Delay (tpd): 7.1 ns

Although slightly higher than the nominal propagation delay, the 7.1 ns delay is still within an acceptable range for efficient signal transmission in most applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environmental conditions, making this product suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate logic implementation, providing an extra level of control and flexibility in data transmission.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in extreme cold environments, making this product suitable for a wide range of operating conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and electrical conductivity, ensuring a reliable connection with the circuit board.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and maintenance, making this product user-friendly and accessible for servicing.

No. of Ports: 2

Having 2 ports allows for separate input and output connections, providing versatility in signal routing and connectivity options.

Maximum Seated Height: 1.4 mm

The low maximum seated height helps reduce the overall profile of the device, making it suitable for slim and compact electronic designs.

Width: 5.5 mm

The compact width of 5.5mm allows for efficient use of space on the circuit board, enabling dense and intricate layout designs.

Output Polarity: TRUE

The true output polarity ensures consistent and reliable signal transmission, helping to prevent errors in data processing and interpretation.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage allows for operation in low-power environments, making this product suitable for battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 20

The specified maximum time at peak reflow temperature ensures proper soldering during assembly, guaranteeing optimal electrical performance.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance ensures reliability during soldering processes, making this product suitable for automated assembly techniques.

Length: 13.5 mm

The moderate length of 13.5mm allows for easy integration into various system layouts, providing flexibility in circuit design.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding environments, making this product suitable for rugged applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form facilitates easy installation and soldering onto the circuit board, ensuring a secure and reliable connection.

Packing Method: TR

The specified TR packing method ensures safe and secure transportation and storage of the product, reducing the risk of damage during handling.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for precise and compact soldering connections, enabling high-density circuit board layouts.

Control Type: ENABLE LOW/HIGH

The enable low/high control type provides flexibility in signal management, allowing for easy integration with different system architectures and protocols.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates moderate moisture sensitivity, ensuring the product's reliability during storage and operation in humid environments.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance provides versatility in power supply options, allowing for compatibility with a wide range of operating conditions.

Maximum Power Supply Current (ICC): 0.04 mA

The low maximum power supply current ensures energy efficiency and minimizes power consumption, making this product suitable for battery-operated devices.

Technical Specifications

Bus Driver & Transceivers SN74LVC32373AGKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVC32373AGKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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