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SN74LVC32244GKER

Texas Instruments

SN74LVC32244GKER by Texas Instruments

SN74LVC32244GKER by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.1 ns, operating at a supply voltage of 3.3V. It features a low profile grid array package and is ideal for industrial applications requiring true output polarity and enable low control type.

Median Price

$0.870

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,786 parts In-Stock

1+ parts

$0.870

100+ parts

$0.850

1k+ parts

$0.840

10k+ parts

-

10,786

$0.870

$0.850

$0.840

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,035 parts In-Stock

1+ parts

-

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7,035

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Chip Stock

USA . 5,500 parts In-Stock

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5,500

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Connect4Technologies Inc.

Canada . 993 parts In-Stock

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993

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EPE Components Inc.

USA . 577 parts In-Stock

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577

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Bristol Electronics

USA . 577 parts In-Stock

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577

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Digiode

USA . 344 parts In-Stock

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344

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Legend Electronics Inc.

USA . 105 parts In-Stock

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105

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Connector Distribution Corp

USA . 54 parts In-Stock

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54

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Right Parts Inc.

USA . 54 parts In-Stock

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54

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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25

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Semi Source

USA . 10 parts In-Stock

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10

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$15.822

100+ parts

-

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620

$15.822

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Parana Technologies

USA . 1,587 parts In-Stock

1+ parts

$28.951

100+ parts

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$53.587

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1,587

$28.951

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$53.587

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DigiPath Technology Company

USA . 959 parts In-Stock

1+ parts

$31.878

100+ parts

$29.328

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959

$31.878

$29.328

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ChromeModa Solutions

Germany . 3,283 parts In-Stock

1+ parts

$32.529

100+ parts

$26.674

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3,283

$32.529

$26.674

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$32.529

100+ parts

$30.903

1k+ parts

$29.276

10k+ parts

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1,243

$32.529

$30.903

$29.276

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One Stop Electronics

USA . 1,349 parts In-Stock

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$52.000

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1,349

$52.000

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Andel Nordic

Denmark . 3,837 parts In-Stock

1+ parts

$107.137

100+ parts

-

1k+ parts

$102.851

10k+ parts

$102.851

3,837

$107.137

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$102.851

$102.851

Corphita

USA . 4,288 parts In-Stock

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4,288

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Microchip USA

USA . 426 parts In-Stock

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426

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Speed Components Ltd (Excess)

Israel . 100 parts In-Stock

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100

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Cyclops Electronics Ltd (Excess)

UK . 25 parts In-Stock

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25

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Overview

Discover the exceptional quality and reliability of Texas Instruments with the SN74LVC32244GKER Bus Driver & Transceivers. Designed for a variety of applications, this product offers customers unmatched value and benefits. With a low propagation delay, true output polarity, and 3-STATE output characteristics, this device ensures efficient and effective performance. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 4.1 ns

Low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes installation easy and efficient, saving time and effort during assembly.

No. of Functions: 8

Having multiple functions in a single device increases versatility and flexibility in designing complex systems.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage helps in reducing power consumption and heat dissipation, improving overall energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without performance degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-powered devices and sensitive applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC32244GKER attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

4

No. of Functions:

8

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

4.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Translation:

N/A

Width:

5.5 mm

Trade Compliance

SN74LVC32244GKER Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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