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SN74LVC2952APWR

Texas Instruments

SN74LVC2952APWR by Texas Instruments

SN74LVC2952APWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 8.2 ns at 1.8V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and independent control for bidirectional communication in a small outline package.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,950 parts In-Stock

1+ parts

$0.941

100+ parts

$0.724

1k+ parts

$0.381

10k+ parts

-

7,950

$0.941

$0.724

$0.381

-

Rochester

USA . 5,622 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

$0.537

10k+ parts

$0.479

5,622

-

$0.647

$0.537

$0.479

DigiKey

USA . 5,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.810

10k+ parts

-

5,622

-

-

$0.810

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Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.671

10k+ parts

$0.598

2,000

-

-

$0.671

$0.598

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 638 parts In-Stock

1+ parts

$0.503

100+ parts

-

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638

$0.503

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Vyrian

USA . 7,012 parts In-Stock

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7,012

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Microfarads

USA . 1,761 parts In-Stock

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-

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1,761

-

-

-

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Bristol Electronics

USA . 997 parts In-Stock

1+ parts

-

100+ parts

$0.566

1k+ parts

$0.392

10k+ parts

-

997

-

$0.566

$0.392

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Dan-Mar Components

USA . 997 parts In-Stock

1+ parts

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997

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,207 parts In-Stock

1+ parts

$0.476

100+ parts

-

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-

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4,207

$0.476

-

-

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Component Stockers USA

USA . 6,198 parts In-Stock

1+ parts

$0.550

100+ parts

$0.510

1k+ parts

$0.460

10k+ parts

-

6,198

$0.550

$0.510

$0.460

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Andel Nordic

Denmark . 2,559 parts In-Stock

1+ parts

$5.122

100+ parts

-

1k+ parts

$4.917

10k+ parts

$4.917

2,559

$5.122

-

$4.917

$4.917

Parana Technologies

USA . 653 parts In-Stock

1+ parts

$16.607

100+ parts

$1,542.249

1k+ parts

$14.947

10k+ parts

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653

$16.607

$1,542.249

$14.947

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DigiPath Technology Company

USA . 822 parts In-Stock

1+ parts

$18.287

100+ parts

-

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822

$18.287

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ChromeModa Solutions

Germany . 3,151 parts In-Stock

1+ parts

$18.660

100+ parts

$15.301

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3,151

$18.660

$15.301

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IDEA Electronic Components Group

UK . 2,131 parts In-Stock

1+ parts

$18.660

100+ parts

$17.727

1k+ parts

$16.794

10k+ parts

-

2,131

$18.660

$17.727

$16.794

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Microchip USA

USA . 3,346 parts In-Stock

1+ parts

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3,346

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Perfect Parts

USA . 1,729 parts In-Stock

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1,729

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Overview

Unlock seamless data transmission with the SN74LVC2952APWR by Texas Instruments. Crafted with precision and quality, this bus driver and transceiver offers unparalleled performance in a compact package. Ideal for a range of applications, this product ensures reliable communication between devices with its advanced features. Trust Texas Instruments to deliver cutting-edge solutions that bring value, efficiency, and innovation to your projects. Experience the difference with the SN74LVC2952APWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 8.2 ns

The low propagation delay ensures quick and efficient signal transmission, improving overall performance.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage helps in reducing power consumption and operating costs.

Maximum I (ol): 24 Amp

The high maximum output current capability allows for driving of heavy loads, making it versatile for different applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC2952APWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

8.2 ns

Propagation Delay (tpd):

8.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

SN74LVC2952APWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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