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SN74LVC16373AZQLR

Texas Instruments

SN74LVC16373AZQLR by Texas Instruments

SN74LVC16373AZQLR by Texas Instruments is an 8-bit bus driver with 3-STATE output characteristics. It has a propagation delay of 4.2 ns at 1.8V, making it suitable for industrial applications requiring fast data transmission. With a package style of GRID ARRAY and very thin profile, it is ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,653 parts In-Stock

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Digiode

USA . 1,965 parts In-Stock

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NPI Materials, Inc.

USA . 5 parts In-Stock

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AZTECH Wire

Italy . 290 parts In-Stock

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$5.520

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$5.520

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Andel Nordic

Denmark . 2,141 parts In-Stock

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$11.091

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$10.648

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$10.648

2,141

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$10.648

Parana Technologies

USA . 1,574 parts In-Stock

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$16.833

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$17.076

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ChromeModa Solutions

Germany . 6,981 parts In-Stock

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$18.913

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$15.509

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6,981

$18.913

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IDEA Electronic Components Group

UK . 454 parts In-Stock

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$18.913

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$17.967

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$17.022

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454

$18.913

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$17.022

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One Stop Electronics

USA . 460 parts In-Stock

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$23.000

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Perfect Parts

USA . 16,875 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,269 parts In-Stock

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Corphita

USA . 4,374 parts In-Stock

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DigiPath Technology Company

USA . 716 parts In-Stock

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Metaverse IC Inc.

Canada . 200 parts In-Stock

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Microchip USA

USA . 162 parts In-Stock

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Overview

Unlock seamless data transmission and reliable performance with the SN74LVC16373AZQLR by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and efficiency. Ideal for a wide range of applications, this product ensures quick propagation delay and low power consumption. Experience the value and benefits of this top-tier component, featuring 3-state output characteristics and true output polarity. Elevate your projects with Texas Instruments' innovative technology and trust in the reliability of the SN74LVC16373AZQLR for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and reduce the overall weight of the device.

Propagation Delay At Nominal Supply: 4.2 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

No. of Functions: 2

Having multiple functions in a single component increases functionality and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

The wide operating temperature range makes the product suitable for industrial applications where temperature variations are common.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance, which is useful in bus driver applications for effectively controlling the bus lines.

Technology: CMOS

CMOS technology provides low power consumption and noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC16373AZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.5 mm

Trade Compliance

SN74LVC16373AZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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