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SN74LVC16373AGRDR

Texas Instruments

SN74LVC16373AGRDR by Texas Instruments

SN74LVC16373AGRDR by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.2 ns and output characteristics in 3-STATE. It operates at a supply voltage range of 1.65V to 3.6V, making it suitable for industrial applications requiring fast signal transmission and low power consumption. The package style is grid array with thin profile, ideal for surface mount designs in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,636 parts In-Stock

1+ parts

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6,636

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Digiode

USA . 2,117 parts In-Stock

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2,117

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Distributors (Availability)

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Parana Technologies

USA . 1,778 parts In-Stock

1+ parts

$8.363

100+ parts

-

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$8.992

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1,778

$8.363

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$8.992

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Andel Nordic

Denmark . 2,883 parts In-Stock

1+ parts

$8.653

100+ parts

-

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$8.307

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$8.307

2,883

$8.653

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$8.307

$8.307

DigiPath Technology Company

USA . 2,236 parts In-Stock

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$9.209

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2,236

$9.209

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IDEA Electronic Components Group

UK . 1,304 parts In-Stock

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$9.397

100+ parts

$8.927

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$8.457

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1,304

$9.397

$8.927

$8.457

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ChromeModa Solutions

Germany . 128 parts In-Stock

1+ parts

$9.397

100+ parts

$7.706

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128

$9.397

$7.706

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AZTECH Wire

Italy . 696 parts In-Stock

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$10.336

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$10.336

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One Stop Electronics

USA . 253 parts In-Stock

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$22.000

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$22.000

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Corphita

USA . 746 parts In-Stock

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Microchip USA

USA . 356 parts In-Stock

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Overview

Unlock the power of seamless data transfer with the SN74LVC16373AGRDR by Texas Instruments. Designed with precision and excellence, this bus driver & transceiver offers unparalleled reliability and performance. Whether you're working on industrial automation, telecommunications, or automotive applications, this product is guaranteed to meet your needs with its cutting-edge technology and superior quality. Experience faster propagation delays, lower power consumption, and efficient signal transmission with this innovative solution. Upgrade your system today and discover the difference this product can make for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures the product is tough and able to withstand daily wear and tear.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast data transmission and efficient performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

Operates effectively at a low nominal supply voltage, making it energy-efficient.

Load Capacitance (CL): 50 pF

Optimal load capacitance for stable and reliable signal transmission.

Maximum Operating Temperature: 85 °C

Capable of functioning in high-temperature environments without overheating.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signals, enhancing versatility.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, ideal for bus driver applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC16373AGRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B54

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.5 mm

Trade Compliance

SN74LVC16373AGRDR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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