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SN74LVC16245AZQLR

Texas Instruments

SN74LVC16245AZQLR by Texas Instruments

SN74LVC16245AZQLR by Texas Instruments is a bus driver & transceiver with 8 bits and a propagation delay of 4 ns. It operates at a nominal voltage of 1.8V and has a max operating temperature of 85°C. This component is commonly used in industrial applications requiring bidirectional control and common control features.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

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-

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$1.150

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$0.955

10k+ parts

$0.851

19

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$1.150

$0.955

$0.851

Distributors (In-Stock)

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Digiode

USA . 1,344 parts In-Stock

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$0.891

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$0.891

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Vyrian

USA . 8,744 parts In-Stock

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8,744

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Cyclops Electronics Ltd

UK . 667 parts In-Stock

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Sea View Technologies

USA . 88 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 19 parts In-Stock

1+ parts

$0.800

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$0.800

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Corphita

USA . 614 parts In-Stock

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$0.844

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614

$0.844

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Andel Nordic

Denmark . 430 parts In-Stock

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$10.612

100+ parts

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$10.188

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$10.188

430

$10.612

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$10.188

$10.188

AZTECH Wire

Italy . 460 parts In-Stock

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$15.444

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460

$15.444

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Parana Technologies

USA . 1,991 parts In-Stock

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$23.145

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$23.782

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$23.145

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$23.782

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DigiPath Technology Company

USA . 658 parts In-Stock

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$25.486

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658

$25.486

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ChromeModa Solutions

Germany . 3,044 parts In-Stock

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$26.006

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$21.325

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3,044

$26.006

$21.325

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IDEA Electronic Components Group

UK . 2,339 parts In-Stock

1+ parts

$26.006

100+ parts

$24.706

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$23.405

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2,339

$26.006

$24.706

$23.405

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Kepictronics

USA . 4,278 parts In-Stock

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Argo Parts USA

USA . 4,183 parts In-Stock

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Continental Prestige Electronics

USA . 2,015 parts In-Stock

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Microchip USA

USA . 221 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Discover the SN74LVC16245AZQLR by Texas Instruments, a top-quality Bus Driver & Transceiver that delivers unmatched performance. With its innovative technology and reliable manufacturing process, Texas Instruments ensures exceptional functionality and durability. This versatile product is perfect for various applications, offering customers incredible value and benefits. Experience seamless data transmission, enhanced efficiency, and precise control with the SN74LVC16245AZQLR. Trust Texas Instruments to deliver outstanding solutions that meet your needs. Upgrade your systems today and unlock limitless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 4 ns

With a low propagation delay, this product ensures fast and efficient transmission of data, making it ideal for applications that require quick response times.

Surface Mount: YES

The surface mount capability of this product enables easy and convenient installation onto printed circuit boards, reducing assembly time and costs.

No. of Functions: 2

With multiple functions integrated into one device, this product offers versatility and compactness, saving space and simplifying the design process.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and alignment during assembly, contributing to a streamlined production process.

No. of Bits: 8

The presence of 8 bits in this product enables the transmission and processing of data in larger quantities, enhancing its capability for handling complex tasks.

Translation: N/A

Although this product does not involve translation, its design ensures accurate and reliable transmission without any data loss or distortion.

Nominal Supply Voltage / Vsup (V): 1.8

With a low nominal supply voltage, this product offers energy efficiency and compatibility with a wide range of systems that operate on low power levels.

Power Supplies (V): 3.3

The availability of multiple power supplies at 3.3V ensures stable and consistent operation, increasing the reliability and performance of this product.

No. of Terminals: 56

The ample number of terminals provided in this product allows for seamless connectivity with other components, facilitating seamless data exchange and control.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style of this product, with a very thin profile and fine pitch, enables high-density mounting, making it perfect for space-constrained applications.

Maximum I (ol): 24 Amp

With a high maximum output current of 24 Amps, this product can support heavy loads, making it suitable for driving bus systems with demanding power requirements.

Propagation Delay (tpd): 7.1 ns

The propagation delay of 7.1 ns ensures reliable and efficient signal transmission, minimizing any delays or errors in data transmission.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this product to withstand harsh environments and maintain optimal performance even in extreme conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics of this product provide flexibility in controlling the bus lines, allowing for effective bus management and preventing contention between multiple drivers.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product remains operational in extremely cold climates or environments, ensuring reliability and stability.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish provides excellent conductivity and resistance to corrosion, enhancing the longevity and reliability of this product.

Terminal Position: BOTTOM

The bottom terminal position of this product simplifies the installation process, allowing for easy and secure connections within the system.

No. of Ports: 2

With two ports available, this product enables simultaneous communication and data exchange between multiple devices, optimizing system efficiency.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm allows for compact and space-saving designs, making this product suitable for applications with size limitations.

Width: 4.5 mm

The narrow width of 4.5 mm offers compatibility with compact systems and tight spacing on printed circuit boards, ensuring efficient utilization of available space.

Output Polarity: TRUE

The true output polarity of this product ensures accurate and reliable data transfer, eliminating any confusion or errors in signal interpretation.

Minimum Supply Voltage (Vsup): 1.65 V

With a low minimum supply voltage, this product remains functional even during low-power situations, providing uninterrupted operation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering during assembly, resulting in reliable connections and long-term performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures effective soldering, preventing component detachment or soldering defects, improving product reliability.

Length: 7 mm

The compact length of 7 mm allows for easy integration into various system designs, providing flexibility and compatibility with different form factors.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of this product ensures reliable operation in harsh temperature environments, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology employed in this product offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing overall performance.

Terminal Form: BALL

The ball terminal form provides strong and reliable connections, making this product suitable for applications that require secure and robust electrical connections.

Packing Method: TR

The TR (tape and reel) packing method simplifies automated assembly processes, reducing handling time and ensuring product integrity during shipping and storage.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65 mm, this product allows for high-density mounting, contributing to compact and space-efficient system designs.

Count Direction: BIDIRECTIONAL

The bidirectional count direction capability of this product offers versatility in data communication, enabling seamless transmission and reception in both directions.

Control Type: COMMON CONTROL

The common control type simplifies the control and management of multiple drivers in a bus system, promoting efficient and synchronized operation.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product maintains proper moisture resistance during storage and reflow processes, preventing damage or performance degradation.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V accommodates systems that require power at higher voltage levels, ensuring compatibility with diverse applications.

Maximum Power Supply Current (ICC): 0.02 mA

With a low maximum power supply current of 0.02 mA, this product exhibits excellent energy efficiency, minimizing power consumption and maximizing battery life.

Technical Specifications

Bus Driver & Transceivers SN74LVC16245AZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

7.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.5 mm

Trade Compliance

SN74LVC16245AZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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