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SN74LVC126ADGVRE4

Texas Instruments

SN74LVC126ADGVRE4 by Texas Instruments

SN74LVC126ADGVRE4 by Texas Instruments is a 4-function bus driver with a propagation delay of 6 ns at 1.8V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity TRUE, and terminal finish Ni/Pd/Au. The package style is small outline with dual terminal position and GULL WING form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,128 parts In-Stock

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Digiode

USA . 2,390 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,374 parts In-Stock

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$7.000

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$7.000

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Parana Technologies

USA . 2,034 parts In-Stock

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$7.393

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$7.884

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$7.393

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ChromeModa Solutions

Germany . 4,235 parts In-Stock

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$8.307

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$6.812

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$8.307

$6.812

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IDEA Electronic Components Group

UK . 838 parts In-Stock

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$8.307

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$7.892

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$7.476

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838

$8.307

$7.892

$7.476

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Andel Nordic

Denmark . 3,632 parts In-Stock

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$8.733

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$8.384

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$8.384

3,632

$8.733

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$8.384

$8.384

AZTECH Wire

Italy . 226 parts In-Stock

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$10.350

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Corphita

USA . 3,025 parts In-Stock

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DigiPath Technology Company

USA . 1,581 parts In-Stock

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$7.490

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Microchip USA

USA . 1,245 parts In-Stock

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Overview

Elevate your electronic designs with the SN74LVC126ADGVRE4 by Texas Instruments, a top-tier manufacturer known for delivering premium quality components. As a Bus Driver & Transceiver, this versatile product offers fast propagation delays and low power consumption, making it ideal for a wide range of applications. With its 3-STATE output characteristics and true output polarity, this small outline package ensures reliable performance in automotive-grade environments. Trust in Texas Instruments to provide innovative solutions that enhance the value of your projects. Elevate your designs today with the SN74LVC126ADGVRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making this product suitable for various applications and operating conditions.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures quick response time, making this product ideal for high-speed communication systems.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and resources during production.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V helps in reducing power consumption and increasing energy efficiency.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB, enabling the integration of multiple components in a limited area.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, which can be useful in bus systems where multiple drivers may be connected to the same line.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliability in automotive applications where the product may be exposed to extreme temperature variations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC126ADGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

4.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

11.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.6 mm

Trade Compliance

SN74LVC126ADGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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