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SN74LV573ATDGVRE4

Texas Instruments

SN74LV573ATDGVRE4 by Texas Instruments

SN74LV573ATDGVRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.5 ns and output current of 16 Amp. It operates at a supply voltage of 5V, suitable for industrial applications requiring fast signal transmission in compact spaces. The package style is small outline with dual terminals, making it ideal for surface mount designs with limited space constraints.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,213 parts In-Stock

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8,213

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Digiode

USA . 1,643 parts In-Stock

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1,643

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Distributors (Availability)

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Andel Nordic

Denmark . 4,892 parts In-Stock

1+ parts

$7.343

100+ parts

-

1k+ parts

$7.049

10k+ parts

$7.049

4,892

$7.343

-

$7.049

$7.049

AZTECH Wire

Italy . 201 parts In-Stock

1+ parts

$17.845

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201

$17.845

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Parana Technologies

USA . 202 parts In-Stock

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$24.068

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-

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$24.720

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202

$24.068

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$24.720

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DigiPath Technology Company

USA . 804 parts In-Stock

1+ parts

$26.502

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-

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804

$26.502

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ChromeModa Solutions

Germany . 4,953 parts In-Stock

1+ parts

$27.043

100+ parts

$22.175

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4,953

$27.043

$22.175

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IDEA Electronic Components Group

UK . 1,659 parts In-Stock

1+ parts

$27.043

100+ parts

$25.691

1k+ parts

$24.339

10k+ parts

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1,659

$27.043

$25.691

$24.339

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One Stop Electronics

USA . 808 parts In-Stock

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$47.000

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808

$47.000

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Corphita

USA . 1,840 parts In-Stock

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1,840

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Microchip USA

USA . 324 parts In-Stock

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324

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Overview

Enhance your electronic designs with the SN74LV573ATDGVRE4 by Texas Instruments, a reliable and high-quality Bus Driver & Transceiver. Built by a trusted manufacturer, this product offers unmatched performance and durability for various applications. With 8 bits and a propagation delay of just 10.5ns, this component provides fast and efficient data transmission. Its compact design and industrial-grade temperature tolerance make it ideal for a wide range of projects. Trust Texas Instruments to deliver top-notch components that will elevate your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage during transportation or installation.

Propagation Delay At Nominal Supply: 10.5 ns

This low propagation delay ensures fast and efficient communication within the bus system, leading to improved overall performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with many common bus systems, ensuring easy integration.

Output Characteristics: 3-STATE

The 3-STATE output allows for high flexibility in controlling bus signals, enabling efficient data transmission and management.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74LV573ATDGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV573ATDGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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