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SN74LV374ATNSG4

Texas Instruments

SN74LV374ATNSG4 by Texas Instruments

SN74LV374ATNSG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 18.5ns at 2.5V, operating up to 50MHz. It features a small outline package and is ideal for industrial applications requiring positive edge triggering and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,538 parts In-Stock

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6,538

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Digiode

USA . 3,806 parts In-Stock

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3,806

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Distributors (Availability)

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One Stop Electronics

USA . 320 parts In-Stock

1+ parts

$12.000

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-

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320

$12.000

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AZTECH Wire

Italy . 342 parts In-Stock

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$17.249

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342

$17.249

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Parana Technologies

USA . 268 parts In-Stock

1+ parts

$18.308

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$18.442

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268

$18.308

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$18.442

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DigiPath Technology Company

USA . 2,229 parts In-Stock

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$20.160

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2,229

$20.160

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ChromeModa Solutions

Germany . 4,518 parts In-Stock

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$20.571

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$16.868

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4,518

$20.571

$16.868

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$20.571

100+ parts

$19.542

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$18.514

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1,462

$20.571

$19.542

$18.514

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Andel Nordic

Denmark . 2,431 parts In-Stock

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$185.042

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$177.640

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$177.640

2,431

$185.042

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$177.640

$177.640

Corphita

USA . 2,395 parts In-Stock

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2,395

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Microchip USA

USA . 491 parts In-Stock

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491

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Overview

Discover the reliability and innovation of Texas Instruments with the SN74LV374ATNSG4 Bus Driver & Transceiver. This versatile component offers 8 bits of power in a compact package, making it ideal for a wide range of applications. With a nominal supply voltage of 2.5V and a maximum frequency of 50MHz, this product provides high performance and efficiency. Trust in Texas Instruments for quality engineering and superior design, ensuring that your projects run smoothly and effectively. Elevate your designs with the SN74LV374ATNSG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 18.5 ns

Offers fast signal processing, ensuring efficient operation of the bus driver & transceiver.

Surface Mount: YES

Allows for easy installation on PCBs, saving time during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal voltage for reliable operation of the bus driver & transceiver.

Package Style (Meter): SMALL OUTLINE

Compact size makes it suitable for space-constrained applications.

Maximum I (ol): 8 Amp

High output current capability for driving bus lines and transceiver circuits.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a variety of environments.

Maximum Frequency At Nominal Supply: 50000000 Hz

High-frequency operation allows for fast data transmission on the bus lines.

Technical Specifications

Bus Driver & Transceivers SN74LV374ATNSG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

50000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

18.5 ns

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Trade Compliance

SN74LV374ATNSG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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