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SN74LV21ADBR

Texas Instruments

SN74LV21ADBR by Texas Instruments

SN74LV21ADBR by Texas Instruments is a logic gate with 2 functions and 4 inputs. It has a propagation delay of 12 ns at 2.5V, suitable for industrial applications. This CMOS technology device operates b/w -40 to 85°C, with a max supply voltage of 5.5V and power supply current of 0.02 mA.

Median Price

$0.244

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,124 parts In-Stock

1+ parts

$0.430

100+ parts

$0.232

1k+ parts

$0.196

10k+ parts

$0.188

4,124

$0.430

$0.232

$0.196

$0.188

Rochester

USA . 25,795 parts In-Stock

1+ parts

-

100+ parts

$0.217

1k+ parts

$0.180

10k+ parts

$0.161

25,795

-

$0.217

$0.180

$0.161

DigiKey

USA . 25,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.270

25,795

-

-

-

$0.270

Verical

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.201

20,000

-

-

-

$0.201

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,864 parts In-Stock

1+ parts

$0.123

100+ parts

-

1k+ parts

-

10k+ parts

-

3,864

$0.123

-

-

-

Nova Conductors

Japan . 78 parts In-Stock

1+ parts

$0.311

100+ parts

-

1k+ parts

-

10k+ parts

-

78

$0.311

-

-

-

DigiKey Marketplace

USA . 25,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.130

10k+ parts

-

25,795

-

-

$0.130

-

Vyrian

USA . 6,795 parts In-Stock

1+ parts

-

100+ parts

-

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6,795

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 17,377 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

-

10k+ parts

-

17,377

$0.110

-

-

-

Corphita

USA . 1,573 parts In-Stock

1+ parts

$0.116

100+ parts

-

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1,573

$0.116

-

-

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Microchip USA

USA . 1,672 parts In-Stock

1+ parts

$0.936

100+ parts

-

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1,672

$0.936

-

-

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Parana Technologies

USA . 1,971 parts In-Stock

1+ parts

$14.703

100+ parts

-

1k+ parts

$15.144

10k+ parts

-

1,971

$14.703

-

$15.144

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DigiPath Technology Company

USA . 1,826 parts In-Stock

1+ parts

$16.190

100+ parts

$14.894

1k+ parts

-

10k+ parts

-

1,826

$16.190

$14.894

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ChromeModa Solutions

Germany . 1,167 parts In-Stock

1+ parts

$16.520

100+ parts

$13.546

1k+ parts

-

10k+ parts

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1,167

$16.520

$13.546

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IDEA Electronic Components Group

UK . 752 parts In-Stock

1+ parts

$16.520

100+ parts

$15.694

1k+ parts

$14.868

10k+ parts

-

752

$16.520

$15.694

$14.868

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Perfect Parts

USA . 8,600 parts In-Stock

1+ parts

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8,600

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your electronic projects with the SN74LV21ADBR by Texas Instruments, a high-quality logic gate that offers reliable performance and precision. Manufactured by the trusted name in semiconductor technology, this component is perfect for a wide range of applications in digital circuits, data processing, and signal processing. With its low propagation delay, small form factor, and wide operating temperature range, this product provides exceptional value and efficiency to customers looking to optimize their designs. Trust Texas Instruments for superior quality and innovation in every component.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and protection for the internal components, making it suitable for various environments.

Propagation Delay At Nominal Supply

12 ns - Offers fast signal processing, ensuring efficient operation in time-critical applications.

Surface Mount

YES - Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

No. of Functions

2 - Offers versatility in circuit design, allowing for complex logical operations to be performed.

No. of Inputs

4 - Provides flexibility in input options, enabling the gate to process multiple signals simultaneously.

Package Shape

RECTANGULAR - Facilitates easy integration into different circuit layouts, optimizing space utilization.

Nominal Supply Voltage / Vsup (V)

2.5 - Works well with low-voltage systems, ensuring compatibility with a wide range of applications.

Load Capacitance (CL)

50 pF - Ensures stable performance by handling capacitance effectively within the circuit.

Power Supplies (V)

3.3 - Supports standard power requirements, making it compatible with most electronic devices.

No. of Terminals

14 - Provides ample connection points for interfacing with other components in the circuit.

Package Style (Meter)

SMALL OUTLINE, SHRINK PITCH - Offers a compact design for space-constrained applications, enabling efficient circuit layout.

Maximum I (ol)

12 Amp - Handles high output current, making it suitable for driving heavy loads in the circuit.

Propagation Delay (tpd)

19 ns - Ensures reliable signal propagation with minimal delay, enhancing overall system performance.

Maximum Operating Temperature

85 °C - Maintains functionality even in high-temperature environments, ensuring reliability under varying conditions.

Minimum Operating Temperature

40 °C - Functions reliably in low-temperature settings, providing consistent performance in diverse operating conditions.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Offers corrosion resistance and reliable electrical contact for long-term use.

Terminal Position

DUAL - Facilitates easy connectivity with other components, enhancing the overall functionality of the circuit.

Maximum Seated Height

2 mm - Allows for a low-profile design, ideal for applications with limited vertical space.

Width

5.3 mm - Provides a compact form factor, ideal for applications where space is a premium.

Minimum Supply Voltage (Vsup)

2 V - Supports low-voltage operation, ensuring compatibility with a wide range of power sources.

Peak Reflow Temperature °C

260 - Withstands high-temperature reflow processes during assembly, ensuring robust solder joints.

Length

6.2 mm - Offers a balanced form factor, suitable for various circuit board layouts.

Temperature Grade

INDUSTRIAL - Meets industry standards for temperature tolerance, ensuring reliable operation in demanding environments.

Technology

CMOS - Employs CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form

GULL WING - Facilitates secure soldering onto circuit boards, ensuring stable connections for long-term use.

Packing Method

TR - Provides a standardized packing method for easy handling and storage, ensuring product integrity during transportation.

Terminal Pitch

0.65 mm - Offers a fine pitch for efficient board layout, enabling high-density integration in compact devices.

Maximum Supply Voltage (Vsup)

5.5 V - Supports a wide range of power supply voltages, ensuring compatibility with various systems.

Maximum Power Supply Current (ICC)

0.02 mA - Operates with low power consumption, ideal for battery-powered or energy-efficient applications.

Technical Specifications

Logic Gates SN74LV21ADBR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LV21ADBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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