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SN74LV125ATPWE4

Texas Instruments

SN74LV125ATPWE4 by Texas Instruments

SN74LV125ATPWE4 by Texas Instruments is a 4-bit bus driver with a propagation delay of 10.5 ns at 5V, suitable for automotive applications. It features a small outline package with dual terminals and operates b/w -40 to 125°C temperature range. The device has a max supply voltage of 5.5V and supports true output polarity in a compact form factor for efficient signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,817 parts In-Stock

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4,817

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Vyrian

USA . 2,682 parts In-Stock

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2,682

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,559 parts In-Stock

1+ parts

$8.195

100+ parts

-

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$7.867

10k+ parts

$7.867

3,559

$8.195

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$7.867

$7.867

AZTECH Wire

Italy . 655 parts In-Stock

1+ parts

$15.400

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655

$15.400

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Parana Technologies

USA . 1,652 parts In-Stock

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$20.061

100+ parts

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$19.991

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1,652

$20.061

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$19.991

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ChromeModa Solutions

Germany . 4,899 parts In-Stock

1+ parts

$22.540

100+ parts

$18.483

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4,899

$22.540

$18.483

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IDEA Electronic Components Group

UK . 948 parts In-Stock

1+ parts

$22.540

100+ parts

$21.413

1k+ parts

$20.286

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948

$22.540

$21.413

$20.286

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One Stop Electronics

USA . 587 parts In-Stock

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$27.000

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587

$27.000

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Corphita

USA . 4,166 parts In-Stock

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DigiPath Technology Company

USA . 1,644 parts In-Stock

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$20.322

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1,644

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$20.322

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Microchip USA

USA . 102 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LV125ATPWE4 by Texas Instruments, a top-quality bus driver & transceiver that offers exceptional performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this versatile component is perfect for various applications. Experience seamless connectivity and fast signal transmission with its 3-STATE output characteristics and ultra-low propagation delay. Trust in the innovative technology and advanced features of this product to bring value and efficiency to your projects. Elevate your creations with the SN74LV125ATPWE4 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the device lightweight and durable, ideal for use in automotive applications.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast and efficient signal transmission, reducing latency in communication systems.

Surface Mount: YES

Surface mount technology makes installation easier and more convenient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes integration with existing systems seamless and compatible.

Maximum I (ol): 16 Amp

High output current capability of 16A allows the device to drive heavy loads without overheating or performance degradation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 to 125°C ensures reliable performance in extreme environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the device.

Technical Specifications

Bus Driver & Transceivers SN74LV125ATPWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LV125ATPWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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