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SN74LS444FN3

Texas Instruments

SN74LS444FN3 by Texas Instruments

SN74LS444FN3 by Texas Instruments is a TTL technology logic IC with 20 terminals in a square chip carrier package. It operates at temperatures b/w 0°C to 70°C and has a nominal voltage of 5V. This IC is commonly used in commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,281 parts In-Stock

1+ parts

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3,281

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Digiode

USA . 1,379 parts In-Stock

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1,379

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 852 parts In-Stock

1+ parts

$6.000

100+ parts

-

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852

$6.000

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AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$11.196

100+ parts

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647

$11.196

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Parana Technologies

USA . 822 parts In-Stock

1+ parts

$16.694

100+ parts

-

1k+ parts

$16.955

10k+ parts

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822

$16.694

-

$16.955

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DigiPath Technology Company

USA . 1,857 parts In-Stock

1+ parts

$18.382

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1,857

$18.382

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ChromeModa Solutions

Germany . 5,780 parts In-Stock

1+ parts

$18.757

100+ parts

$15.381

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5,780

$18.757

$15.381

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IDEA Electronic Components Group

UK . 1,790 parts In-Stock

1+ parts

$18.757

100+ parts

$17.819

1k+ parts

$16.881

10k+ parts

-

1,790

$18.757

$17.819

$16.881

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Corphita

USA . 4,926 parts In-Stock

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4,926

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Overview

Unlock the power of innovation with the SN74LS444FN3 by Texas Instruments. Crafted with precision and expertise, this logic IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless functionality and optimal performance. Embrace the future of technology with Texas Instruments and experience the value, benefits, and advantages that the SN74LS444FN3 brings to your projects. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape enables efficient use of board space and facilitates uniform placement on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this IC compatible with standard power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can function reliably under normal operating conditions.

Technology: TTL

TTL technology offers fast response times and low power consumption, making this IC suitable for high-speed applications.

Technical Specifications

Other Function Logic ICs SN74LS444FN3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS444FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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