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SN74LS31J

Texas Instruments

SN74LS31J by Texas Instruments

SN74LS31J by Texas Instruments is a TTL technology delay line with 6 functions, 48 ns propagation delay at 5V. It has 16 terminals in an in-line package and operates b/w 0-70°C. Ideal for applications requiring precise signal delays.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,603 parts In-Stock

1+ parts

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4,603

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Vyrian

USA . 2,314 parts In-Stock

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2,314

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 260 parts In-Stock

1+ parts

$4.000

100+ parts

-

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260

$4.000

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$12.423

100+ parts

-

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292

$12.423

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Parana Technologies

USA . 741 parts In-Stock

1+ parts

$21.539

100+ parts

-

1k+ parts

$21.925

10k+ parts

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741

$21.539

-

$21.925

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DigiPath Technology Company

USA . 929 parts In-Stock

1+ parts

$23.717

100+ parts

$21.820

1k+ parts

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929

$23.717

$21.820

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IDEA Electronic Components Group

UK . 1,350 parts In-Stock

1+ parts

$24.201

100+ parts

$22.991

1k+ parts

$21.781

10k+ parts

-

1,350

$24.201

$22.991

$21.781

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ChromeModa Solutions

Germany . 716 parts In-Stock

1+ parts

$24.201

100+ parts

$19.845

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-

10k+ parts

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716

$24.201

$19.845

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Corphita

USA . 4,352 parts In-Stock

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4,352

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Overview

Upgrade your electronic projects with the SN74LS31J by Texas Instruments, a high-quality delay line that offers precision and reliability. Texas Instruments is known for its cutting-edge technology and innovation, making this product a top choice for applications requiring accurate signal processing. Whether you're working on telecommunications, industrial automation, or automotive electronics, the SN74LS31J delivers superior performance with minimal propagation delay and low power consumption. Trust Texas Instruments to provide the value and benefits you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package offers excellent thermal performance and mechanical strength, ensuring durability and reliability.

Propagation Delay At Nominal Supply: 48 ns

Low propagation delay ensures high-speed signal processing, making this delay line suitable for time-critical applications.

No. of Functions: 6

Having 6 functions in one component simplifies circuit design and reduces component count, leading to cost savings and improved efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes it compatible with a wide range of digital systems and simplifies integration.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the delay line to function reliably in various environmental conditions without performance degradation.

Technical Specifications

Delay Lines SN74LS31J attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Functions:

6

No. of Taps/Steps:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Propagation Delay At Nominal Supply:

48 ns

Qualification:

Not Qualified

Sub-Category:

Delay Lines

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS31J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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