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SN74LS31NP1

Texas Instruments

SN74LS31NP1 by Texas Instruments

SN74LS31NP1 by Texas Instruments is a TTL technology delay line with 6 functions, 48 ns propagation delay at 5V. It has 16 terminals in an in-line package and operates b/w 0-70°C. Ideal for applications requiring precise signal delays.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,418 parts In-Stock

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6,418

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Digiode

USA . 4,477 parts In-Stock

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4,477

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,302 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,302

$9.000

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AZTECH Wire

Italy . 720 parts In-Stock

1+ parts

$14.099

100+ parts

-

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720

$14.099

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Parana Technologies

USA . 442 parts In-Stock

1+ parts

$21.408

100+ parts

-

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$21.755

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442

$21.408

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$21.755

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DigiPath Technology Company

USA . 624 parts In-Stock

1+ parts

$23.573

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624

$23.573

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IDEA Electronic Components Group

UK . 2,363 parts In-Stock

1+ parts

$24.054

100+ parts

$22.851

1k+ parts

$21.649

10k+ parts

-

2,363

$24.054

$22.851

$21.649

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ChromeModa Solutions

Germany . 746 parts In-Stock

1+ parts

$24.054

100+ parts

$19.724

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746

$24.054

$19.724

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Corphita

USA . 3,523 parts In-Stock

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3,523

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Overview

Discover the unparalleled quality and reliability of the SN74LS31NP1 by Texas Instruments, a leading manufacturer in the industry. This delay line device offers a multitude of applications in various electronic systems, providing customers with unmatched value and performance. With a fast propagation delay and multiple functions, this product ensures optimal efficiency and precision. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and enhances your projects. Choose the SN74LS31NP1 for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and reliability for the delay lines, making it a good choice for long-term use.

Propagation Delay At Nominal Supply: 48 ns

The low propagation delay of 48 ns ensures fast and efficient signal transmission, making this delay line suitable for high-speed applications.

No. of Functions: 6

With 6 functions, this delay line offers versatility in signal processing and can be used in a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is common and easily accessible, making it convenient for integration into existing systems.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm allows for easy connection and installation of the delay line, enhancing usability and flexibility in circuit designs.

Technical Specifications

Delay Lines SN74LS31NP1 attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Functions:

6

No. of Taps/Steps:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Propagation Delay At Nominal Supply:

48 ns

Qualification:

Not Qualified

Sub-Category:

Delay Lines

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS31NP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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