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SN74LS31JP4

Texas Instruments

SN74LS31JP4 by Texas Instruments

SN74LS31JP4 by Texas Instruments is a TTL technology delay line with 6 functions and 48 ns propagation delay at 5V. It has 16 terminals in an in-line package, operating b/w 0-70°C. Ideal for applications requiring precise signal timing in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,678 parts In-Stock

1+ parts

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3,678

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Digiode

USA . 2,044 parts In-Stock

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-

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2,044

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$8.003

100+ parts

-

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897

$8.003

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Parana Technologies

USA . 356 parts In-Stock

1+ parts

$24.289

100+ parts

-

1k+ parts

$24.951

10k+ parts

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356

$24.289

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$24.951

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DigiPath Technology Company

USA . 329 parts In-Stock

1+ parts

$26.745

100+ parts

-

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329

$26.745

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ChromeModa Solutions

Germany . 1,175 parts In-Stock

1+ parts

$27.291

100+ parts

$22.379

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1,175

$27.291

$22.379

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IDEA Electronic Components Group

UK . 27 parts In-Stock

1+ parts

$27.291

100+ parts

$25.926

1k+ parts

$24.562

10k+ parts

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27

$27.291

$25.926

$24.562

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One Stop Electronics

USA . 818 parts In-Stock

1+ parts

$56.000

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818

$56.000

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Corphita

USA . 983 parts In-Stock

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983

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Overview

Enhance your electronic designs with the SN74LS31JP4 by Texas Instruments, a high-quality delay line component that offers superior performance and reliability. Designed by a leading manufacturer in the industry, this product is perfect for a wide range of applications in various electronic systems. With its low propagation delay and efficient power consumption, the SN74LS31JP4 provides exceptional value and benefits to customers looking to optimize their designs. Trust Texas Instruments for cutting-edge technology and innovation that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and reliability, making this delay line suitable for long-term use in various environments.

Propagation Delay At Nominal Supply: 48 ns

With a low propagation delay, this delay line ensures efficient signal transmission and processing in electronic circuits.

No. of Functions: 6

Having multiple functions allows for versatile use of this delay line in different applications, offering flexibility and convenience.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes this delay line compatible with standard electronic systems and easy to integrate.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this delay line can withstand elevated temperatures without compromising performance.

Technology: TTL

Utilizing TTL technology ensures fast and reliable signal processing, making this delay line suitable for high-speed applications.

Technical Specifications

Delay Lines SN74LS31JP4 attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Functions:

6

No. of Taps/Steps:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Propagation Delay At Nominal Supply:

48 ns

Sub-Category:

Delay Lines

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS31JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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