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SN74LS31DRE4

Texas Instruments

SN74LS31DRE4 by Texas Instruments

SN74LS31DRE4 by Texas Instruments is a TTL delay line with 48ns propagation delay at 5V. It has 16 terminals, operates b/w 0-70°C, and supports surface mount installation. Ideal for applications requiring true output polarity and a total delay of 95ns in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,823 parts In-Stock

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Vyrian

USA . 2,150 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Parana Technologies

USA . 182 parts In-Stock

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$11.478

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$11.892

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182

$11.478

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$11.892

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ChromeModa Solutions

Germany . 2,185 parts In-Stock

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$12.897

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$10.576

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$12.897

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

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$12.897

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$12.252

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$11.607

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$11.607

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AZTECH Wire

Italy . 778 parts In-Stock

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$14.063

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778

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Ampacity Inc.

Singapore . 442 parts In-Stock

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$20.000

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One Stop Electronics

USA . 689 parts In-Stock

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$44.000

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$44.000

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Corphita

USA . 4,321 parts In-Stock

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DigiPath Technology Company

USA . 1,328 parts In-Stock

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$11.628

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Microchip USA

USA . 287 parts In-Stock

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Aranea Global

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Overview

Unlock the power of precision and reliability with the SN74LS31DRE4 delay line by Texas Instruments. Designed with cutting-edge technology and unmatched quality, this product offers a seamless experience for applications requiring precise timing control. From industrial automation to telecommunications, this delay line delivers exceptional performance, ensuring optimal efficiency and accuracy. Trust in Texas Instruments to provide you with the solutions you need to stay ahead in a fast-paced world. Experience the difference with the SN74LS31DRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the delay line suitable for various applications.

Propagation Delay At Nominal Supply: 48 ns

Provides a fast propagation delay, making it ideal for time-sensitive applications where precise timing is crucial.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with many electronic systems.

Load Capacitance (CL): 15 pF

With a low load capacitance, the delay line can easily drive capacitive loads without significant signal degradation.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, making it suitable for both indoor and outdoor applications.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures without performance degradation, ensuring reliable operation in various environments.

Technology: TTL

Uses TTL technology, known for its high speed and reliability, ensuring accurate and consistent signal processing.

Technical Specifications

Delay Lines SN74LS31DRE4 attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

Additional Features:

INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS

Family:

LS

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Taps/Steps:

0

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Propagation Delay At Nominal Supply:

48 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Nominal Total Delay (td):

95 ns

Width:

3.9 mm

Trade Compliance

SN74LS31DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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