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SN74LS245DBRG4

Texas Instruments

SN74LS245DBRG4 by Texas Instruments

SN74LS245DBRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 12ns at 5V. It features a 3-STATE output and operates within a temperature range of 0 to 70°C. Commonly used in bidirectional control applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 26,900 parts In-Stock

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Vyrian

USA . 6,954 parts In-Stock

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Digiode

USA . 1,688 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Andel Nordic

Denmark . 928 parts In-Stock

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$3.041

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-

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$2.919

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$2.919

928

$3.041

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$2.919

$2.919

AZTECH Wire

Italy . 575 parts In-Stock

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$8.452

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575

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Semicontronic

India . 325 parts In-Stock

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$12.000

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$11.700

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$11.640

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325

$12.000

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$11.640

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Ampacity Inc.

Singapore . 868 parts In-Stock

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$15.000

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$15.000

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Corohmni

South Africa . 125 parts In-Stock

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$29.523

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$29.523

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Parana Technologies

USA . 44 parts In-Stock

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$30.026

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$66.148

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$66.148

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IDEA Electronic Components Group

UK . 2,136 parts In-Stock

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$33.737

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$32.050

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$30.363

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ChromeModa Solutions

Germany . 1,976 parts In-Stock

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$33.737

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$27.664

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One Stop Electronics

USA . 479 parts In-Stock

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$41.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,477 parts In-Stock

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Corphita

USA . 4,614 parts In-Stock

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Argo Parts USA

USA . 3,721 parts In-Stock

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Continental Prestige Electronics

USA . 2,721 parts In-Stock

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Microchip USA

USA . 1,921 parts In-Stock

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DigiPath Technology Company

USA . 1,187 parts In-Stock

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$30.417

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Advanced Electronics

New Zealand . 500 parts In-Stock

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500

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Bastille Electronics

Australia . 97 parts In-Stock

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Overview

Unlock seamless data transmission with the SN74LS245DBRG4 by Texas Instruments, a top-of-the-line Bus Driver & Transceiver. Crafted with precision and expertise by a renowned manufacturer, this product ensures reliable performance and unmatched quality. Perfect for a wide range of applications, this 8-bit device offers exceptional value to customers looking for fast propagation delays, versatile power supplies, and a compact package style. Experience efficiency and innovation with this powerful component, designed to meet your every connectivity need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, increasing the overall reliability of the product.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures fast signal transmission, making this bus driver/transceiver suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and stable supply voltage of 5V, making it compatible with a wide range of systems and circuits.

Maximum I (ol): 24 Amp

High output current capability allows for driving of heavy loads, making this bus driver/transceiver versatile and suitable for various applications.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, reducing the chances of errors or misinterpretation in data communication.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic levels, making this driver/transceiver easy to integrate into existing TTL-based systems.

Technical Specifications

Bus Driver & Transceivers SN74LS245DBRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

95 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74LS245DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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