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SN74LS05DRE4

Texas Instruments

SN74LS05DRE4 by Texas Instruments

SN74LS05DRE4 by Texas Instruments is a TTL logic gate with 6 functions, 32 ns propagation delay at 5V. It has open-collector output characteristics and operates b/w 0-70°C. Ideal for applications requiring fast signal processing in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,436 parts In-Stock

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6,436

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Digiode

USA . 3,174 parts In-Stock

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3,174

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,112 parts In-Stock

1+ parts

$5.000

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-

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1,112

$5.000

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Corohmni

South Africa . 43 parts In-Stock

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$10.049

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43

$10.049

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AZTECH Wire

Italy . 325 parts In-Stock

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$15.168

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325

$15.168

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Parana Technologies

USA . 693 parts In-Stock

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$24.052

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$24.708

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693

$24.052

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$24.708

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ChromeModa Solutions

Germany . 2,683 parts In-Stock

1+ parts

$27.025

100+ parts

$22.160

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2,683

$27.025

$22.160

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IDEA Electronic Components Group

UK . 1,360 parts In-Stock

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$27.025

100+ parts

$25.674

1k+ parts

$24.322

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1,360

$27.025

$25.674

$24.322

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One Stop Electronics

USA . 290 parts In-Stock

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$34.000

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290

$34.000

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Microchip USA

USA . 12,939 parts In-Stock

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Continental Prestige Electronics

USA . 6,563 parts In-Stock

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Argo Parts USA

USA . 4,052 parts In-Stock

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4,052

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DigiPath Technology Company

USA . 911 parts In-Stock

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$24.366

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911

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$24.366

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Bastille Electronics

Australia . 300 parts In-Stock

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Corphita

USA . 122 parts In-Stock

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122

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Overview

Enhance your electronic projects with the SN74LS05DRE4 logic gates by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a product that offers precise signal processing and seamless integration. Ideal for various applications in digital circuits, these logic gates provide fast signal propagation and low power consumption, ensuring efficient performance. Upgrade your projects with the trusted brand of Texas Instruments and experience unmatched value and benefits that only the SN74LS05DRE4 can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures that signals are processed quickly, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and improving efficiency.

No. of Functions: 6

Having multiple functions in one component reduces the need for additional parts, simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration with other components straightforward.

Load Capacitance (CL): 15 pF

The low load capacitance helps maintain signal integrity and efficiency in high-frequency applications.

Power Supplies (V): 5

Having a consistent power supply voltage ensures reliable performance under various conditions.

No. of Terminals: 14

Having multiple terminals allows for easy connectivity and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the circuit board and is ideal for compact designs.

Maximum I (ol): 8 Amp

The high output current capability allows for driving larger loads without the need for additional amplification circuits.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other components and devices in the circuit.

Maximum Operating Temperature: 70 °C

Being able to operate at high temperatures ensures reliability and stability in various environmental conditions.

Minimum Operating Temperature: 0 °C

The wide operating temperature range makes this product suitable for use in diverse applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides corrosion resistance and ensures reliable connections for extended product life.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and ease of connection.

Maximum Seated Height: 1.75 mm

The low profile design saves space on the circuit board and allows for compact device designs.

Width: 3.9 mm

The small width of the component enables tight packing of components on the circuit board, optimizing space usage.

Minimum Supply Voltage (Vsup): 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

Withstanding high reflow temperatures ensures reliable soldering during assembly.

Length: 8.65 mm

The compact length of the component contributes to space-saving and efficient design layouts.

Temperature Grade: COMMERCIAL

Suitable for commercial applications, this temperature grade ensures performance in standard operating conditions.

Technology: TTL

Utilizing TTL technology provides reliable and proven logic functionality for a wide range of applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and ensures secure connections on the circuit board.

Packing Method: TR

Tray packaging method ensures safe transportation and storage of the component prior to installation.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy integration with standard spacing on circuit boards.

Maximum Supply Voltage (Vsup): 5.25 V

The higher maximum supply voltage tolerance provides added protection against voltage spikes and variations.

Maximum Power Supply Current (ICC): 6.6 mA

Low power supply current consumption ensures energy efficiency and minimizes heat dissipation.

Technical Specifications

Logic Gates SN74LS05DRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

6.6 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LS05DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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