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SN74HC7002PWRE4

Texas Instruments

SN74HC7002PWRE4 by Texas Instruments

SN74HC7002PWRE4 by Texas Instruments is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 33 ns at 5V, making it suitable for industrial applications requiring fast response times. With a small outline package style and Schmitt trigger technology, it is ideal for surface mount designs in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,821 parts In-Stock

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Digiode

USA . 3,308 parts In-Stock

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One Stop Electronics

USA . 516 parts In-Stock

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$3.000

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Parana Technologies

USA . 1,487 parts In-Stock

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$11.514

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$11.927

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ChromeModa Solutions

Germany . 1,653 parts In-Stock

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$12.937

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$10.608

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IDEA Electronic Components Group

UK . 1,032 parts In-Stock

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$12.937

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$12.290

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$11.643

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AZTECH Wire

Italy . 721 parts In-Stock

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$17.312

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Component Stockers USA

USA . 210 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,638 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 1,151 parts In-Stock

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Microchip USA

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Overview

Unlock the power of advanced logic gates with the SN74HC7002PWRE4 by Texas Instruments. Manufactured with precision and expertise, this versatile component is perfect for a wide range of applications. With a compact design and superior performance, this logic gate offers unparalleled speed and reliability. Say goodbye to delays and inefficiencies - choose the SN74HC7002PWRE4 for seamless integration and enhanced functionality in your projects. Trust Texas Instruments to deliver top-quality components that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 33 ns

The fast propagation delay ensures quick signal processing, making the product efficient for time-sensitive operations.

Surface Mount: YES

Surface mount capability allows for easy and space-saving installation on PCBs.

No. of Functions: 4

With multiple functions in one component, the product offers versatility and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage enables compatibility with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving overall performance.

Power Supplies (V): 2/6

Supporting a range of power supply voltages makes the product flexible for use in various environments.

Maximum I (ol): 4 Amp

The high output current capability allows the product to drive heavy loads with ease.

Temperature Grade: INDUSTRIAL

Operating within industrial temperature ranges ensures reliability and stability in harsh environments.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger helps in eliminating noise and providing hysteresis for clean signal transitions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates SN74HC7002PWRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

163 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74HC7002PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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