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SN74HC640PWT

Texas Instruments

SN74HC640PWT by Texas Instruments

SN74HC640PWT by Texas Instruments is an 8-bit bus driver with a propagation delay of 26ns at 5V. It features a small outline package, operates in industrial temperatures (-40 to 85°C), and has dual terminal positions. Ideal for bidirectional control applications requiring inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,545 parts In-Stock

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Digiode

USA . 4,188 parts In-Stock

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4,188

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Distributors (Availability)

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Andel Nordic

Denmark . 2,583 parts In-Stock

1+ parts

$3.768

100+ parts

-

1k+ parts

$3.618

10k+ parts

$3.618

2,583

$3.768

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$3.618

$3.618

AZTECH Wire

Italy . 508 parts In-Stock

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$9.917

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508

$9.917

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Parana Technologies

USA . 185 parts In-Stock

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$25.439

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$26.070

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185

$25.439

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$26.070

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DigiPath Technology Company

USA . 1,018 parts In-Stock

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$28.011

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1,018

$28.011

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ChromeModa Solutions

Germany . 2,631 parts In-Stock

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$28.583

100+ parts

$23.438

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2,631

$28.583

$23.438

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IDEA Electronic Components Group

UK . 4 parts In-Stock

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$28.583

100+ parts

$27.154

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$25.725

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4

$28.583

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$25.725

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One Stop Electronics

USA . 523 parts In-Stock

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$43.000

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523

$43.000

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Corphita

USA . 4,268 parts In-Stock

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Microchip USA

USA . 1,367 parts In-Stock

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Overview

Unlock seamless communication with the SN74HC640PWT by Texas Instruments - a top-quality Bus Driver & Transceiver. With advanced technology and reliability, this product offers 8 bits for efficient data transmission. Ideal for industrial applications, this compact device ensures fast propagation delay and 3-state output characteristics. Experience exceptional performance and value with Texas Instruments' cutting-edge solutions. Elevate your projects with the SN74HC640PWT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 26 ns

Low propagation delay ensures fast signal transmission, making this product efficient for data communication.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and making assembly simpler.

Package Shape: RECTANGULAR

The rectangular shape of the package design allows for efficient layout on a PCB, optimizing space and enabling compact device design.

No. of Bits: 8

With 8 bits, this product can handle a range of data processing tasks, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V ensures compatibility with common power sources and devices.

Power Supplies (V): 2/6

Support for a range of power supply voltages (2-6V) provides flexibility in system integration and compatibility with various setups.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionality, enhancing the versatility and capabilities of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design with shrink pitch makes the product suitable for compact and space-constrained applications.

Maximum I (ol): 6 Amp

High output current capability (6A) allows the product to drive external loads effectively, increasing its usefulness in various scenarios.

Technical Specifications

Bus Driver & Transceivers SN74HC640PWT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

235 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74HC640PWT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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