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SN74HC573AQPWRQ1

Texas Instruments

SN74HC573AQPWRQ1 by Texas Instruments

SN74HC573AQPWRQ1 by Texas Instruments is an 8-bit bus driver with a propagation delay of 53ns, suitable for automotive applications. It operates at a nominal voltage of 5V and has a max operating temperature of 125°C. This CMOS technology device features a small outline package with dual terminals and supports surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,885 parts In-Stock

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5,885

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Digiode

USA . 3,102 parts In-Stock

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3,102

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Distributors (Availability)

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Andel Nordic

Denmark . 47 parts In-Stock

1+ parts

$1.104

100+ parts

-

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$1.059

10k+ parts

$1.059

47

$1.104

-

$1.059

$1.059

AZTECH Wire

Italy . 286 parts In-Stock

1+ parts

$11.771

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286

$11.771

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One Stop Electronics

USA . 390 parts In-Stock

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$25.000

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390

$25.000

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Parana Technologies

USA . 397 parts In-Stock

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$27.236

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$33.539

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397

$27.236

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$33.539

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DigiPath Technology Company

USA . 2,023 parts In-Stock

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$29.990

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2,023

$29.990

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ChromeModa Solutions

Germany . 5,627 parts In-Stock

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$30.602

100+ parts

$25.094

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5,627

$30.602

$25.094

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IDEA Electronic Components Group

UK . 495 parts In-Stock

1+ parts

$30.602

100+ parts

$29.072

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$27.542

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495

$30.602

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$27.542

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Corphita

USA . 2,180 parts In-Stock

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Microchip USA

USA . 322 parts In-Stock

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Overview

Enhance the performance of your automotive electronic systems with the SN74HC573AQPWRQ1 by Texas Instruments. Designed with top-quality materials and cutting-edge CMOS technology, this 8-bit bus driver/transceiver ensures fast signal propagation and reliable data transmission. With a wide operating temperature range and AEC-Q100 screening level, this compact device is perfect for automotive applications. Trust Texas Instruments for superior quality and efficiency in every component, bringing value and peace of mind to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver and transceiver, ensuring reliable operation in various conditions.

Propagation Delay At Nominal Supply: 53 ns

Fast propagation delay ensures quick response time in data transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

Ease of installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it a dependable choice for automotive applications.

Nominal Supply Voltage / Vsup: 5V

Standard 5V supply voltage ensures compatibility with many systems and devices, making integration easier.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in harsh environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74HC573AQPWRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

335 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74HC573AQPWRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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