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SN74HC541PWG4

Texas Instruments

SN74HC541PWG4 by Texas Instruments

SN74HC541PWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 29ns at 5V. It features a small outline package, dual terminal position, and true output polarity. Ideal for industrial applications requiring low power consumption and high-speed data transmission in a compact form factor.

Median Price

$0.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 210 parts In-Stock

1+ parts

$0.200

100+ parts

$0.200

1k+ parts

$0.190

10k+ parts

-

210

$0.200

$0.200

$0.190

-

Mouser Electronics

USA . 357 parts In-Stock

1+ parts

$1.260

100+ parts

$0.878

1k+ parts

$0.725

10k+ parts

$0.507

357

$1.260

$0.878

$0.725

$0.507

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,521 parts In-Stock

1+ parts

$0.499

100+ parts

-

1k+ parts

-

10k+ parts

-

3,521

$0.499

-

-

-

Chip Stock

USA . 24,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24,060

-

-

-

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Vyrian

USA . 2,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,254

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,238 parts In-Stock

1+ parts

$0.472

100+ parts

-

1k+ parts

-

10k+ parts

-

4,238

$0.472

-

-

-

Parana Technologies

USA . 84 parts In-Stock

1+ parts

$15.683

100+ parts

-

1k+ parts

$16.053

10k+ parts

-

84

$15.683

-

$16.053

-

ChromeModa Solutions

Germany . 2,294 parts In-Stock

1+ parts

$17.621

100+ parts

$14.449

1k+ parts

-

10k+ parts

-

2,294

$17.621

$14.449

-

-

IDEA Electronic Components Group

UK . 1,920 parts In-Stock

1+ parts

$17.621

100+ parts

$16.740

1k+ parts

$15.859

10k+ parts

-

1,920

$17.621

$16.740

$15.859

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Microchip USA

USA . 2,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,427

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-

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DigiPath Technology Company

USA . 224 parts In-Stock

1+ parts

-

100+ parts

$15.887

1k+ parts

-

10k+ parts

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224

-

$15.887

-

-

Overview

Experience seamless data transmission with the Texas Instruments SN74HC541PWG4 bus driver & transceiver. Manufactured with precision and expertise, this product offers reliable performance in various applications. With a compact design and low power consumption, this device provides value and efficiency to customers looking for high-quality solutions. Trust Texas Instruments for cutting-edge technology that delivers unparalleled results. Upgrade your system with the SN74HC541PWG4 and enjoy seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 29 ns

Fast propagation delay allows for quick signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Easy to install on circuit boards, saving time and effort during the manufacturing process.

No. of Bits: 8

Ideal for handling data transmission with an 8-bit width, suitable for various communication protocols.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, ensuring easy integration into existing systems.

No. of Terminals: 20

Sufficient terminals for versatile connectivity options, making it suitable for complex communication setups.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a concern.

Output Characteristics: 3-STATE

3-state output allows for multiple devices to share a common bus, enhancing flexibility in system design.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74HC541PWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

206 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74HC541PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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