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SN74HC373ADBR

Texas Instruments

SN74HC373ADBR by Texas Instruments

SN74HC373ADBR by Texas Instruments is an 8-bit latch with a propagation delay of 31ns, operating b/w -40 to 85°C. It features a 3-STATE output and can handle up to 6A current. Ideal for industrial applications requiring high-speed data storage and transfer in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,681 parts In-Stock

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Vyrian

USA . 4,233 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,338 parts In-Stock

1+ parts

$11.000

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$11.000

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Parana Technologies

USA . 691 parts In-Stock

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$15.377

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$15.765

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691

$15.377

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$15.765

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AZTECH Wire

Italy . 330 parts In-Stock

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$16.917

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330

$16.917

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DigiPath Technology Company

USA . 2,155 parts In-Stock

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$16.932

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2,155

$16.932

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ChromeModa Solutions

Germany . 5,773 parts In-Stock

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$17.278

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$14.168

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5,773

$17.278

$14.168

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IDEA Electronic Components Group

UK . 1,686 parts In-Stock

1+ parts

$17.278

100+ parts

$16.414

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$15.550

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1,686

$17.278

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Component Stockers USA

USA . 234 parts In-Stock

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$99.990

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Corphita

USA . 4,417 parts In-Stock

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Microchip USA

USA . 205 parts In-Stock

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Overview

Unlock the power of seamless data storage and transfer with the SN74HC373ADBR by Texas Instruments. Crafted with precision and quality, this latch & flip-flop device offers unparalleled reliability and performance. Ideal for industrial applications, this product boasts a compact design and high-speed operation, making it a valuable asset for your projects. Trust Texas Instruments to deliver cutting-edge solutions that elevate your work to the next level. Upgrade your systems today with the SN74HC373ADBR and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable, lightweight, and cost-effective, making this latch or flip-flop a reliable choice for various applications.

Propagation Delay At Nominal Supply: 31 ns

With a fast propagation delay, this latch or flip-flop can quickly respond to input changes, ensuring efficient operation in time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard board layouts and allows for efficient use of space on the PCB.

No. of Bits: 8

With 8 bits, this latch or flip-flop can handle a wide range of data inputs, making it suitable for applications requiring multiple binary states.

Load Capacitance (CL): 50 pF

The moderate load capacitance ensures stability in the output signal, preventing distortions and maintaining signal integrity.

Power Supplies (V): 2/6

Supporting a range of power supply voltages (2V to 6V) makes this latch or flip-flop versatile and compatible with different system requirements.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with other components and circuits, enabling versatile integration within a system.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style reduces the footprint on the PCB, enabling high-density mounting and saving space in compact designs.

Maximum I (ol): 6 Amp

With a high maximum output current capacity, this latch or flip-flop can drive demanding loads without the risk of overheating or damage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance in harsh environmental conditions or extended operation.

Output Characteristics: 3-STATE

The 3-state output allows this latch or flip-flop to drive the output to a high-impedance state, providing flexibility in controlling signal flow and sharing bus lines.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures dependable operation even in cold environments, expanding the range of applications for this latch or flip-flop.

Terminal Position: DUAL

The dual terminal position offers multiple options for connecting external components or interfacing with the system, enhancing flexibility in circuit design and layout.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this latch or flip-flop meets the requirements for reliability, durability, and performance in challenging industrial environments.

Technology: CMOS

Using CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this latch or flip-flop energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable connections on the PCB, ensuring secure and stable operation of this latch or flip-flop in electronic devices.

Packing Method: TR

The TR (tape and reel) packing method allows for efficient handling, storage, and assembly of this latch or flip-flop, optimizing the manufacturing process and reducing production costs.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm enables high-density mounting and precise placement on the PCB, contributing to compact and efficient circuit board designs.

Technical Specifications

Latches & Flip-Flops SN74HC373ADBR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

31 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74HC373ADBR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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