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SN74HC03DR

Texas Instruments

SN74HC03DR by Texas Instruments

SN74HC03DR by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 31 ns at 5V, making it suitable for industrial applications requiring fast response times. With open-drain output characteristics and a small outline package style, it is ideal for surface mount designs in temperature-sensitive environments.

Median Price

$0.188

Lifecycle Status

Suppliers In-Stock

38

In-Stock Inventory

1k+

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Chip1Stop

Japan . 2,056 parts In-Stock

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Texas Instruments

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Mouser Electronics

USA . 4,235 parts In-Stock

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DigiKey

USA . 2,854 parts In-Stock

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$0.410

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$0.218

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$0.184

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$0.168

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Arrow

USA . 5,000 parts In-Stock

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Rochester

USA . 2,559 parts In-Stock

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Verical

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Digiode

USA . 1,328 parts In-Stock

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Nova Conductors

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Vyrian

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ComSIT USA

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ECAB

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Corel Iberica Componentes, S.L.

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Bristol Electronics

USA . 4,678 parts In-Stock

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North Shore Components

USA . 4,400 parts In-Stock

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Speed Components Ltd

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Connector Distribution Corp

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Right Parts Inc.

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Zilex Electronics Inc.

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EMSNET

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Lighthouse Electronics, Inc.

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Sea View Technologies

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J & M Industries LLC

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Halfin

Belgium . 495 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 221 parts In-Stock

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Rebound Electronics

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Cyclops Electronics Ltd

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LittleDiode

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Semicontronic

India . 20,979 parts In-Stock

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$0.053

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$0.051

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Ampacity Inc.

Singapore . 21,101 parts In-Stock

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Corphita

USA . 1,860 parts In-Stock

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Continental Prestige Electronics

USA . 3,850 parts In-Stock

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Argo Parts USA

USA . 214 parts In-Stock

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Parana Technologies

USA . 474 parts In-Stock

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$19.980

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$19.918

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Corohmni

South Africa . 19 parts In-Stock

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

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$22.449

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$21.327

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$20.204

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ChromeModa Solutions

Germany . 747 parts In-Stock

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$22.449

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Perfect Parts

USA . 138,863 parts In-Stock

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

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A-Z Elektronik GmbH

Germany . 7,490 parts In-Stock

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Kepictronics

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Speed Components Ltd (Excess)

Israel . 3,274 parts In-Stock

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iodParts Technologies Inc.

India . 2,515 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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DigiPath Technology Company

USA . 764 parts In-Stock

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$20.240

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Assy Fe

Spain . 178 parts In-Stock

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Overview

Unlock the power of efficient logic gate operation with the Texas Instruments SN74HC03DR. With a reputation for high-quality manufacturing, Texas Instruments delivers a reliable product that excels in various applications. Perfect for industrial settings, this logic gate offers fast propagation delay and low power consumption, making it an ideal choice for designers looking to optimize performance. Trust Texas Instruments to provide innovative solutions that bring value and reliability to your projects. Step up your game with the SN74HC03DR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 31 ns

Low propagation delay ensures fast processing of signals, making this product suitable for high-speed applications.

No. of Functions: 4

With 4 functions in a single package, this product offers versatility and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the logic gates to function reliably in extreme cold environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making these logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates SN74HC03DR attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

131 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC03DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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