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SN74HC02DRE4

Texas Instruments

SN74HC02DRE4 by Texas Instruments

SN74HC02DRE4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 23 ns at 5V, making it suitable for industrial applications. With a small outline package style and surface mount capability, it offers fast performance in compact designs.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 204,380 parts In-Stock

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Vyrian

USA . 2,697 parts In-Stock

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Digiode

USA . 2,270 parts In-Stock

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Nova Conductors

Japan . 29 parts In-Stock

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Parana Technologies

USA . 2,066 parts In-Stock

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$14.443

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$14.883

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2,066

$14.443

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$14.883

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DigiPath Technology Company

USA . 1,432 parts In-Stock

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$15.903

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$14.631

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$15.903

$14.631

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Ampacity Inc.

Singapore . 840 parts In-Stock

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$16.000

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840

$16.000

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ChromeModa Solutions

Germany . 6,602 parts In-Stock

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$16.228

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$13.307

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$16.228

$13.307

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IDEA Electronic Components Group

UK . 1,815 parts In-Stock

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$16.228

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$15.417

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$14.605

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Corohmni

South Africa . 130 parts In-Stock

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$16.477

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$16.477

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AZTECH Wire

Italy . 234 parts In-Stock

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$17.811

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One Stop Electronics

USA . 1,222 parts In-Stock

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$29.000

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Semicontronic

India . 1,420 parts In-Stock

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$53.000

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$51.675

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$51.410

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Component Stockers USA

USA . 526 parts In-Stock

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$99.990

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Perfect Parts

USA . 4,869 parts In-Stock

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Microchip USA

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Corphita

USA . 4,183 parts In-Stock

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Continental Prestige Electronics

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Speed Components Ltd (Excess)

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Bastille Electronics

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Argo Parts USA

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Overview

Enhance your electronic projects with the SN74HC02DRE4 logic gate from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable performance in every product. Ideal for a wide range of applications, this logic gate offers customers value and versatility. With fast propagation delay and a compact design, this product ensures efficient operation while maintaining a low power supply current. Upgrade your circuits with the SN74HC02DRE4 and experience the benefits of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness, making it a reliable choice for various applications.

Propagation Delay At Nominal Supply: 23 ns

With a fast propagation delay, this logic gate ensures quick signal processing and efficient operation.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 4

Offering multiple functions in a single component, this logic gate helps streamline circuit designs and reduce complexity.

No. of Inputs: 2

With two inputs, this logic gate is suitable for basic logic operations and can be easily integrated into different circuits.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard supply voltage of 5V, this logic gate is compatible with a wide range of systems and applications.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient signal transmission and helps maintain signal integrity within the circuit.

Power Supplies (V): 2/6

Compatible with power supplies ranging from 2V to 6V, this logic gate offers flexibility in voltage requirements for various applications.

No. of Terminals: 14

With 14 terminals, this logic gate provides ample connectivity options for interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact designs and applications.

Maximum I (ol): 5.2 Amp

With a high maximum output current, this logic gate can drive robust loads and handle heavy-duty tasks effectively.

Propagation Delay (tpd): 115 ns

Despite a slight delay, the overall propagation delay of 115 ns is still within acceptable limits for most applications, ensuring reliable performance.

Maximum Operating Temperature: 85°C

Able to operate at temperatures up to 85°C, this logic gate can withstand a range of environmental conditions for reliable performance.

Minimum Operating Temperature: -40°C

With a minimum operating temperature of -40°C, this logic gate is suitable for use in harsh and low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The quality finish of nickel, palladium, and gold provides corrosion resistance and ensures reliable electrical connections for long-term use.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting and allow for various connection configurations to suit different circuit layouts.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm minimizes the profile of the component, making it suitable for slim and space-constrained designs.

Width: 3.91 mm

The compact width of 3.91 mm contributes to the overall small footprint of the component, saving space on the circuit board.

Minimum Supply Voltage (Vsup): 2V

With a minimum supply voltage of 2V, this logic gate can operate efficiently in low-power applications with reduced energy consumption.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and reliable soldering during the manufacturing process.

Length: 8.65 mm

The length of 8.65 mm provides a compact form factor, making this logic gate suitable for space-saving designs and compact devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this logic gate meets the high-performance and reliability standards required in industrial environments.

Technology: CMOS

Using CMOS technology, this logic gate offers low power consumption and high noise immunity, making it suitable for various battery-operated and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, making it suitable for robust and high-vibration environments.

Packing Method: TR

The TR packing method offers ease of handling, storage, and transportation for convenient use in production and assembly processes.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27 mm, this logic gate is compatible with common PCB layouts and facilitates easy integration into circuit designs.

Moisture Sensitivity Level (MSL): 1

The MSL 1 rating indicates low moisture sensitivity, ensuring the component remains stable and reliable during storage and handling.

Maximum Supply Voltage (Vsup): 6V

Capable of handling a maximum supply voltage of 6V, this logic gate offers versatility in voltage requirements for various applications.

Maximum Power Supply Current (ICC): 0.02 mA

Operating with a low maximum power supply current of 0.02 mA, this logic gate helps conserve energy and reduce power consumption during operation.

Technical Specifications

Logic Gates SN74HC02DRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

115 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

SN74HC02DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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