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SN74F244DWG4

Texas Instruments

SN74F244DWG4 by Texas Instruments

SN74F244DWG4 by Texas Instruments is a TTL technology bus driver with 6.5 ns propagation delay, 2 functions, and 3-STATE output characteristics. It operates at a nominal voltage of 5V and is ideal for applications requiring fast signal transmission in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,004 parts In-Stock

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Digiode

USA . 1,448 parts In-Stock

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1,448

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Sogenti Electronics

Canada . 908 parts In-Stock

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908

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Holdelec - ElecDif-Pro

France . 43 parts In-Stock

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43

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Distributors (Availability)

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Andel Nordic

Denmark . 2,919 parts In-Stock

1+ parts

$2.205

100+ parts

-

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$2.117

10k+ parts

$2.117

2,919

$2.205

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$2.117

$2.117

AZTECH Wire

Italy . 829 parts In-Stock

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$13.356

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829

$13.356

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One Stop Electronics

USA . 275 parts In-Stock

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$23.000

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275

$23.000

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Parana Technologies

USA . 1,522 parts In-Stock

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$29.391

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$58.837

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$29.391

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$58.837

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DigiPath Technology Company

USA . 1,460 parts In-Stock

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$32.364

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$29.774

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$32.364

$29.774

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ChromeModa Solutions

Germany . 3,887 parts In-Stock

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$33.024

100+ parts

$27.080

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3,887

$33.024

$27.080

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IDEA Electronic Components Group

UK . 750 parts In-Stock

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$33.024

100+ parts

$31.373

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$29.722

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750

$33.024

$31.373

$29.722

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Corphita

USA . 4,484 parts In-Stock

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Microchip USA

USA . 2,261 parts In-Stock

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Overview

Enhance your electronic designs with the SN74F244DWG4 by Texas Instruments, a top-tier manufacturer known for its quality and reliability. This Bus Driver & Transceiver is a versatile component that offers swift data transmission with a propagation delay of just 6.5 ns, making it perfect for a wide range of applications. With a compact design and efficient performance, this product provides exceptional value to customers seeking seamless connectivity solutions. Upgrade your projects with the superior benefits and advantages of the SN74F244DWG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 6.5 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed data communication.

Surface Mount: YES

The surface mount capability makes installation easy and efficient, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single device adds versatility and functionality to the product, making it a cost-effective solution for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with common power sources, making the product easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable operation and signal integrity, making the product reliable in demanding environments.

Power Supplies (V): 5

The product's power supply requirement matches the nominal supply voltage of 5V, ensuring consistent performance and compatibility with standard power sources.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connectivity options, making the product adaptable to different circuit configurations and applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs, making the product suitable for applications where size constraints are a concern.

Maximum I (ol): 64 Amp

The high output current capability of 64A enables the product to drive large loads, making it suitable for applications that require high power handling.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control over the output signal, providing options for high impedance or active output states, enhancing the product's versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish ensures reliable electrical connections and corrosion resistance, making the product durable and long-lasting.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is designed for standard operating temperatures, suitable for a wide range of commercial applications.

Technology: TTL

The TTL technology used in the product ensures high-speed operation and compatibility with TTL logic levels, making it a reliable choice for digital signal processing applications.

Technical Specifications

Bus Driver & Transceivers SN74F244DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74F244DWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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