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SN74F138DG4

Texas Instruments

SN74F138DG4 by Texas Instruments

SN74F138DG4 by Texas Instruments is a TTL decoder with 9ns propagation delay at 5V. It features inverted output polarity, 16 terminals, and operates b/w 0-70°C. Ideal for applications requiring fast decoding in commercial-grade environments.

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Lifecycle Status

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5

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1k+

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Vyrian

USA . 8,079 parts In-Stock

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Digiode

USA . 3,438 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Semi Source

USA . 229 parts In-Stock

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229

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Prism Electronics

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Parana Technologies

USA . 295 parts In-Stock

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$13.572

100+ parts

$1,260.412

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$12.215

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295

$13.572

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$12.215

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AZTECH Wire

Italy . 318 parts In-Stock

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$14.282

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DigiPath Technology Company

USA . 1,312 parts In-Stock

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$14.945

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$13.749

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$13.749

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ChromeModa Solutions

Germany . 4,164 parts In-Stock

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$15.250

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$12.505

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

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$15.250

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$14.488

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$13.725

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Ampacity Inc.

Singapore . 970 parts In-Stock

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$36.000

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Semicontronic

India . 248 parts In-Stock

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$41.000

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$39.975

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$39.770

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One Stop Electronics

USA . 416 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Perfect Parts

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

The Texas Instruments SN74F138DG4 is a high-quality Decoder & Driver perfect for a wide range of applications. With a reputation for excellence, Texas Instruments delivers reliable products that exceed industry standards. This small outline package offers inverted output polarity, standard input conditioning, and a fast 9 ns propagation delay at nominal supply voltage of 5V. Customers can trust in the value and performance of this product for their decoding and driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, perfect for various applications.

Propagation Delay At Nominal Supply: 9 ns

This low propagation delay ensures fast signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and saves space on the PCB.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of input signals.

Package Shape: RECTANGULAR

The rectangular shape makes the product easy to handle and integrate into electronic systems.

Nominal Supply Voltage / Vsup: 5V

The 5V nominal supply voltage is common and readily available, making the product easy to power.

Power Supplies (V): 5V

The 5V power supply ensures stable operation and compatibility with other components.

No. of Terminals: 16

With 16 terminals, this product offers versatility and flexibility in connecting to other devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, ideal for compact electronic designs.

Maximum I (ol): 20 Amp

The high maximum output current of 20A allows for driving demanding loads with ease.

Propagation Delay (tpd): 9 ns

The low propagation delay of 9ns ensures fast and responsive signal processing.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in harsh environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C enables usage in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for easy connection and ensures secure contact.

Maximum Seated Height: 1.75 mm

The low maximum seated height saves space and allows for compact electronic designs.

Width: 3.9 mm

The small width of 3.9mm enables the product to fit into tight spaces and crowded PCBs.

Output Polarity: INVERTED

The inverted output polarity is suitable for specific applications requiring this configuration.

Minimum Supply Voltage (Vsup): 4.5V

The 4.5V minimum supply voltage ensures reliable operation even under low voltage conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is well within industry standards for soldering processes.

Length: 9.9 mm

The length of 9.9mm provides a compact form factor suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions.

Technology: TTL

The TTL technology used in the product ensures compatibility with TTL logic levels and standards.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly.

Packing Method: TUBE

The tube packing method protects the product during shipping and storage, preventing damage.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy connection and integration into standard PCB layouts.

Maximum Supply Voltage (Vsup): 5.5V

The 5.5V maximum supply voltage ensures safe operation within specified voltage limits.

Maximum Power Supply Current (ICC): 20 mA

The maximum power supply current of 20mA ensures efficient power consumption and safe operation.

Technical Specifications

Decoder & Drivers SN74F138DG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

F/FAST

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74F138DG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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