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SN74CBTLV3857DWE4

Texas Instruments

SN74CBTLV3857DWE4 by Texas Instruments

SN74CBTLV3857DWE4 by Texas Instruments is a 10-bit bus driver with 3.3V nominal voltage, 0.25ns propagation delay, and 2-ports. It is used in industrial applications for true output polarity control in a small outline package measuring 15.365mm x 7.5mm with dual terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,322 parts In-Stock

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Digiode

USA . 3,334 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 559 parts In-Stock

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$17.178

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$17.178

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Parana Technologies

USA . 653 parts In-Stock

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$25.295

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$25.923

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653

$25.295

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$25.923

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DigiPath Technology Company

USA . 1,282 parts In-Stock

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$27.853

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ChromeModa Solutions

Germany . 3,091 parts In-Stock

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$28.421

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$23.305

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3,091

$28.421

$23.305

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$28.421

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$27.000

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$25.579

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113

$28.421

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$25.579

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One Stop Electronics

USA . 395 parts In-Stock

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$35.000

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Corphita

USA . 1,987 parts In-Stock

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Andel Nordic

Denmark . 543 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the SN74CBTLV3857DWE4 by Texas Instruments, a high-quality Bus Driver & Transceivers component that guarantees reliable performance and seamless operation. With Texas Instruments' reputable manufacturing standards, this product offers exceptional value and benefits to customers across various applications. Whether you're working on data communication systems or digital devices, this versatile component ensures superior functionality and efficiency. Trust Texas Instruments for top-notch quality and elevate your projects with the SN74CBTLV3857DWE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver, making it suitable for long-term use in different environments.

No. of Bits: 10

Offers a high level of data transmission and processing capability, making it ideal for complex communication systems.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a commonly used supply voltage, ensuring compatibility with other components in the system.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications that may involve elevated operating conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption, enhancing the energy efficiency of the bus driver & transceiver.

Technical Specifications

Bus Driver & Transceivers SN74CBTLV3857DWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE BUS SWITCH

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.365 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74CBTLV3857DWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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