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SN74CBTLV3383DWE4

Texas Instruments

SN74CBTLV3383DWE4 by Texas Instruments

SN74CBTLV3383DWE4 by Texas Instruments is a 10-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at 2.5/3.3 V power supplies, has 24 terminals in a small outline package, and features 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,538 parts In-Stock

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5,538

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Digiode

USA . 2,791 parts In-Stock

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2,791

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Distributors (Availability)

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AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$17.604

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612

$17.604

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Parana Technologies

USA . 953 parts In-Stock

1+ parts

$26.565

100+ parts

-

1k+ parts

$27.135

10k+ parts

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953

$26.565

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$27.135

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ChromeModa Solutions

Germany . 1,466 parts In-Stock

1+ parts

$29.848

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$24.475

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1,466

$29.848

$24.475

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IDEA Electronic Components Group

UK . 736 parts In-Stock

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$29.848

100+ parts

$28.356

1k+ parts

$26.863

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736

$29.848

$28.356

$26.863

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One Stop Electronics

USA . 1,322 parts In-Stock

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$39.000

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1,322

$39.000

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Microchip USA

USA . 1,837 parts In-Stock

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1,837

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Corphita

USA . 1,133 parts In-Stock

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DigiPath Technology Company

USA . 901 parts In-Stock

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$26.911

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901

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$26.911

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Overview

Enhance your electronic designs with the SN74CBTLV3383DWE4 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This bus driver & transceiver offers seamless data transmission with minimal delay, making it ideal for a wide range of applications. With a small outline package and true output polarity, this product provides exceptional performance while also being easy to integrate into your projects. Trust Texas Instruments for reliability and efficiency, and experience the superior value and benefits that the SN74CBTLV3383DWE4 brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 0.25 ns

Ensures fast operation and signal processing, making the product suitable for high-speed applications.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently at a standard supply voltage, ensuring compatibility with various systems.

No. of Bits: 10

Provides versatility and flexibility in data processing and communication.

Output Characteristics: 3-STATE

Allows the outputs to be in a high-impedance state, enhancing the flexibility and functionality of the device.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with a wide temperature range, ensuring consistent performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74CBTLV3383DWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE BUS SWITCH

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBTLV/3B

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

4

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74CBTLV3383DWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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