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SN74CBTD16211DLG4

Texas Instruments

SN74CBTD16211DLG4 by Texas Instruments

SN74CBTD16211DLG4 by Texas Instruments is a 12-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and has a load capacitance of 50 pF. This CMOS technology device features dual terminal position and true output polarity.

Median Price

$1.980

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 260 parts In-Stock

1+ parts

$1.980

100+ parts

$1.940

1k+ parts

$1.900

10k+ parts

-

260

$1.980

$1.940

$1.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,526 parts In-Stock

1+ parts

$1.615

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

$1.615

-

-

-

Vyrian

USA . 6,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,247

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,921 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

1,921

$1.530

-

-

-

Parana Technologies

USA . 1,032 parts In-Stock

1+ parts

$9.787

100+ parts

-

1k+ parts

$10.359

10k+ parts

-

1,032

$9.787

-

$10.359

-

DigiPath Technology Company

USA . 830 parts In-Stock

1+ parts

$10.777

100+ parts

$9.915

1k+ parts

-

10k+ parts

-

830

$10.777

$9.915

-

-

ChromeModa Solutions

Germany . 2,821 parts In-Stock

1+ parts

$10.997

100+ parts

$9.018

1k+ parts

-

10k+ parts

-

2,821

$10.997

$9.018

-

-

IDEA Electronic Components Group

UK . 1,827 parts In-Stock

1+ parts

$10.997

100+ parts

$10.447

1k+ parts

$9.897

10k+ parts

-

1,827

$10.997

$10.447

$9.897

-

Microchip USA

USA . 1,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,407

-

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Andel Nordic

Denmark . 1,405 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,405

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Overview

Enhance the efficiency and reliability of your electronic designs with the SN74CBTD16211DLG4 by Texas Instruments. Crafted with precision and quality, this bus driver & transceiver offers seamless communication between different components in your circuit. Its advanced technology ensures fast propagation delays and low power consumption, making it ideal for industrial applications where performance is key. Trust in Texas Instruments to deliver cutting-edge solutions that elevate your projects to new heights. Choose the SN74CBTD16211DLG4 for unparalleled value and unmatched benefits in your next design endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design, making it suitable for use in various environments.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay results in quick signal transmission and efficient communication within the bus driver or transceiver.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and simplifying the manufacturing process.

No. of Functions: 2

Having multiple functions in one device can streamline the design and operation of the overall system, increasing efficiency.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and facilitates easy integration into existing designs.

No. of Bits: 12

High number of bits allows for more precise and complex data processing and transmission, enhancing the performance of the bus driver or transceiver.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with most systems and simplifies power management.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stable and reliable signal transmission, reducing the risk of errors or interference.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures reliable operation and prevents voltage fluctuations that could affect performance.

No. of Terminals: 56

Abundance of terminals allows for versatile connectivity options and enables the bus driver or transceiver to interface with multiple components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB, making it suitable for compact designs and high-density applications.

Propagation Delay (tpd): 0.25 ns

Short propagation delay ensures fast signal propagation, reducing latency and improving the overall efficiency of data transmission.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for reliable performance in challenging environmental conditions, increasing product longevity.

Output Characteristics: 3-STATE

3-state output allows for tri-state logic control, providing flexibility in signal routing and enabling efficient bus sharing.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures functionality in extreme cold conditions, making the product suitable for a diverse range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting orientations, offering flexibility in PCB layout and system design.

No. of Ports: 2

Having multiple ports enables simultaneous data transfer and communication with multiple devices, enhancing system efficiency and performance.

Maximum Seated Height: 2.79 mm

Low maximum seated height helps reduce the overall profile of the device, making it suitable for slim and compact designs.

Width: 7.49 mm

Compact width dimension facilitates efficient space utilization on the PCB, allowing for a more streamlined and compact system design.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, minimizing the risk of misinterpretation and ensuring reliable data transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Operating at a minimum supply voltage of 4.5V allows for flexibility in power management and ensures reliable operation even under slight voltage fluctuations.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for safe and reliable soldering during manufacturing processes, ensuring product durability.

Length: 18.415 mm

Optimal length dimension enables easy integration into standard PCB layouts, providing compatibility with existing designs and simplifying installation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the overall efficiency and performance of the device.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and allows for secure mounting on the PCB, ensuring reliable electrical connections and robust mechanical stability.

Packing Method: TUBE

Tube packing method provides secure and organized storage, making it convenient for handling, shipping, and storage of the product.

Terminal Pitch: 0.635 mm

Optimal terminal pitch enables easy connections and compatibility with standard PCB layouts, facilitating efficient assembly and installation.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for versatile signal routing and communication with devices in both directions, enhancing system flexibility and compatibility.

Control Type: ENABLE LOW

Enable low control type simplifies signal control and management, allowing for easy configuration and operation of the bus driver or transceiver.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V ensures safe operation and protects the device from voltage spikes or overloads.

Maximum Power Supply Current (ICC): 1.5 mA

Low power supply current consumption of 1.5mA reduces energy usage and heat dissipation, contributing to overall system efficiency and reliability.

Technical Specifications

Bus Driver & Transceivers SN74CBTD16211DLG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE BUS SWITCH

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

12

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.5 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74CBTD16211DLG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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