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SN74CBT16211AGQLR

Texas Instruments

SN74CBT16211AGQLR by Texas Instruments

SN74CBT16211AGQLR by Texas Instruments is a 12-bit bus driver with 2 functions, operating at a supply voltage of 5V. It features a propagation delay of 0.35ns and output characteristics in 3-STATE. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,486 parts In-Stock

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Digiode

USA . 487 parts In-Stock

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487

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Andel Nordic

Denmark . 598 parts In-Stock

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$7.811

100+ parts

-

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$7.499

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$7.499

598

$7.811

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$7.499

$7.499

AZTECH Wire

Italy . 684 parts In-Stock

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$12.837

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Parana Technologies

USA . 629 parts In-Stock

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$15.490

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$15.866

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629

$15.490

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$15.866

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DigiPath Technology Company

USA . 2,345 parts In-Stock

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$17.057

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$17.057

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ChromeModa Solutions

Germany . 5,752 parts In-Stock

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$17.405

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$14.272

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$14.272

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IDEA Electronic Components Group

UK . 1,058 parts In-Stock

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$17.405

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$16.535

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$15.664

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1,058

$17.405

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$15.664

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One Stop Electronics

USA . 613 parts In-Stock

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$31.000

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$31.000

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QUARKTWIN TECHNOLOGY LTD

USA . 3,256 parts In-Stock

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Corphita

USA . 2,801 parts In-Stock

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Microchip USA

USA . 423 parts In-Stock

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Overview

Enhance your electronic designs with the SN74CBT16211AGQLR by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. This Bus Driver & Transceiver offers seamless performance in a variety of applications, delivering high-quality results with its advanced features. With a true output polarity and ultra-fast propagation delay, this product ensures efficient data transmission while keeping power consumption in check. Trust Texas Instruments to provide the best value and benefits for your projects, making the SN74CBT16211AGQLR an essential component for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material will provide durability and protection for the bus driver & transceivers, making it a reliable choice for long-term use.

No. of Functions: 2

Having 2 functions in one device adds versatility and efficiency to the bus driver & transceivers, allowing for multiple tasks to be performed with a single component.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power systems, making integration easier and more straightforward.

Propagation Delay (tpd): 0.35 ns

With a low propagation delay of 0.35 ns, this bus driver & transceivers can quickly transmit signals, reducing latency and improving overall performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers SN74CBT16211AGQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TTL COMPATIBLE BUS SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B56

Length:

7 mm

Logic IC Type:

No. of Bits:

12

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.5 mm

Trade Compliance

SN74CBT16211AGQLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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