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SN74CB3T16211DLR

Texas Instruments

SN74CB3T16211DLR by Texas Instruments

SN74CB3T16211DLR by Texas Instruments is a 12-bit bus driver with 0.25 ns propagation delay, suitable for industrial applications. It operates at 2.5/3.3V with 56 terminals in a small outline package, featuring true output polarity and bidirectional control type.

Median Price

$1.798

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,601 parts In-Stock

1+ parts

$1.330

100+ parts

$1.300

1k+ parts

$1.280

10k+ parts

-

3,601

$1.330

$1.300

$1.280

-

Texas Instruments

USA . 57,450 parts In-Stock

1+ parts

$2.267

100+ parts

$1.872

1k+ parts

$1.012

10k+ parts

-

57,450

$2.267

$1.872

$1.012

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.530

-

-

-

Digiode

USA . 2,098 parts In-Stock

1+ parts

$2.154

100+ parts

-

1k+ parts

-

10k+ parts

-

2,098

$2.154

-

-

-

Sensible Micro Corp

USA . 6,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,520

-

-

-

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Vyrian

USA . 4,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,955

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,151 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

$1.499

6,151

$1.530

-

-

$1.499

Argo Parts USA

USA . 4,641 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

4,641

$1.530

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.530

100+ parts

$1.499

1k+ parts

$1.453

10k+ parts

$1.423

500

$1.530

$1.499

$1.453

$1.423

Corohmni

South Africa . 573 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

573

$1.530

-

-

-

Ampacity Inc.

Singapore . 57,344 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

-

57,344

$1.930

-

-

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Semicontronic

India . 57,032 parts In-Stock

1+ parts

$1.930

100+ parts

$1.882

1k+ parts

$1.872

10k+ parts

-

57,032

$1.930

$1.882

$1.872

-

Corphita

USA . 1,479 parts In-Stock

1+ parts

$2.040

100+ parts

-

1k+ parts

-

10k+ parts

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1,479

$2.040

-

-

-

Andel Nordic

Denmark . 3,155 parts In-Stock

1+ parts

$3.804

100+ parts

-

1k+ parts

$3.652

10k+ parts

$3.652

3,155

$3.804

-

$3.652

$3.652

AZTECH Wire

Italy . 1,089 parts In-Stock

1+ parts

$11.880

100+ parts

-

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-

10k+ parts

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1,089

$11.880

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-

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Parana Technologies

USA . 2,070 parts In-Stock

1+ parts

$21.563

100+ parts

-

1k+ parts

$21.953

10k+ parts

-

2,070

$21.563

-

$21.953

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DigiPath Technology Company

USA . 127 parts In-Stock

1+ parts

$23.743

100+ parts

$21.844

1k+ parts

-

10k+ parts

-

127

$23.743

$21.844

-

-

ChromeModa Solutions

Germany . 4,200 parts In-Stock

1+ parts

$24.228

100+ parts

$19.867

1k+ parts

-

10k+ parts

-

4,200

$24.228

$19.867

-

-

IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$24.228

100+ parts

$23.017

1k+ parts

$21.805

10k+ parts

-

2,080

$24.228

$23.017

$21.805

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$37.690

100+ parts

$34.298

1k+ parts

$30.906

10k+ parts

-

5,000

$37.690

$34.298

$30.906

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Perfect Parts

USA . 4,630 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,630

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Kepictronics

USA . 270 parts In-Stock

1+ parts

-

100+ parts

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270

-

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Overview

Enhance your electronic designs with the SN74CB3T16211DLR from Texas Instruments, a top-tier manufacturer in the industry. This high-quality bus driver & transceiver offers unmatched reliability and performance for a wide range of applications. Benefit from its efficient propagation delay, versatile surface mount capability, and excellent output characteristics. With Texas Instruments' cutting-edge technology and attention to detail, this product guarantees optimal functionality and value for all your projects. Upgrade your circuits today with the SN74CB3T16211DLR for seamless operation and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the bus driver and transceiver, increasing its reliability and longevity.

Propagation Delay At Nominal Supply: 0.25 ns

With a low propagation delay, this product ensures fast signal transmission and response times, making it suitable for high-speed bus communication systems.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort in the production process.

No. of Functions: 2

Having multiple functions within a single component reduces the need for additional chips, saving space and cost in the overall system design.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this component into various system layouts, maximizing flexibility in design options.

No. of Bits: 12

With a 12-bit capacity, this bus driver and transceiver can handle a wide range of data inputs and outputs, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V, this component is energy-efficient and can help reduce power consumption in the overall system.

Power Supplies (V): 2.5/3.3

Supporting multiple power supply voltages provides compatibility with different system configurations, allowing for greater flexibility in integration.

No. of Terminals: 56

Having a large number of terminals enables this component to connect with various other devices in the system, facilitating secure and efficient data transmission.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the PCB, making it ideal for compact and dense electronic designs.

Technical Specifications

Bus Driver & Transceivers SN74CB3T16211DLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3T/3VT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

12

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.07 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

SN74CB3T16211DLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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