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SN74CB3Q16811DGVR

Texas Instruments

SN74CB3Q16811DGVR by Texas Instruments

SN74CB3Q16811DGVR by Texas Instruments is a 12-bit bus driver with 0.15 ns propagation delay, suitable for industrial applications. It operates at 2.5/3.3V, has 56 terminals in a small outline package, and supports bidirectional control with enable low feature.

Median Price

$1.400

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

$0.941

100+ parts

$0.898

1k+ parts

$0.854

10k+ parts

-

2,000

$0.941

$0.898

$0.854

-

Rochester

USA . 4,867 parts In-Stock

1+ parts

$1.400

100+ parts

$1.370

1k+ parts

$1.340

10k+ parts

-

4,867

$1.400

$1.370

$1.340

-

Texas Instruments

USA . 54,765 parts In-Stock

1+ parts

$2.222

100+ parts

$1.947

1k+ parts

$1.100

10k+ parts

-

54,765

$2.222

$1.947

$1.100

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

$3.167

100+ parts

$3.074

1k+ parts

$1.807

10k+ parts

-

2,000

$3.167

$3.074

$1.807

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.898

1k+ parts

$0.854

10k+ parts

-

2,000

-

$0.898

$0.854

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,138 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,138

$1.330

-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$1.857

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$1.857

-

-

-

Vyrian

USA . 8,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,686 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

12,686

$1.190

-

-

-

Corphita

USA . 3,145 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

-

3,145

$1.260

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.857

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$1.857

-

-

-

Microchip USA

USA . 5,820 parts In-Stock

1+ parts

$9.795

100+ parts

-

1k+ parts

-

10k+ parts

-

5,820

$9.795

-

-

-

Andel Nordic

Denmark . 5,040 parts In-Stock

1+ parts

$17.692

100+ parts

-

1k+ parts

$16.985

10k+ parts

$16.985

5,040

$17.692

-

$16.985

$16.985

AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$21.420

100+ parts

-

1k+ parts

-

10k+ parts

-

215

$21.420

-

-

-

Parana Technologies

USA . 1,260 parts In-Stock

1+ parts

$25.659

100+ parts

-

1k+ parts

$26.260

10k+ parts

-

1,260

$25.659

-

$26.260

-

DigiPath Technology Company

USA . 85 parts In-Stock

1+ parts

$28.253

100+ parts

$25.993

1k+ parts

-

10k+ parts

-

85

$28.253

$25.993

-

-

IDEA Electronic Components Group

UK . 1,842 parts In-Stock

1+ parts

$28.830

100+ parts

$27.388

1k+ parts

$25.947

10k+ parts

-

1,842

$28.830

$27.388

$25.947

-

ChromeModa Solutions

Germany . 313 parts In-Stock

1+ parts

$28.830

100+ parts

$23.641

1k+ parts

-

10k+ parts

-

313

$28.830

$23.641

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Experience superior performance and reliability with the Texas Instruments SN74CB3Q16811DGVR Bus Driver & Transceivers. Designed with precision and quality in mind, this product offers seamless integration and functionality for a wide range of applications. From industrial automation to consumer electronics, this versatile component provides exceptional value, efficiency, and innovation. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 0.15 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount capability.

No. of Functions: 2

Dual functionality allows for flexibility and versatility in various applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for stable and efficient operation of the product.

Power Supplies (V): 2.5/3.3

Compatible with multiple power supply voltages, adding versatility to the product.

No. of Terminals: 56

Sufficient number of terminals for connectivity and integration in complex systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design for space-constrained applications and efficient PCB layout.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, providing flexibility in bus systems and reducing signal interference.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the product.

Technical Specifications

Bus Driver & Transceivers SN74CB3Q16811DGVR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

11.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

12

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

1 mA

Propagation Delay At Nominal Supply:

.15 ns

Propagation Delay (tpd):

.15 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74CB3Q16811DGVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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