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SN74BCT573NSRG4

Texas Instruments

SN74BCT573NSRG4 by Texas Instruments

SN74BCT573NSRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.6 ns at 5V, suitable for commercial applications. It features a small outline package style, operates b/w 0-70°C, and has a max supply voltage of 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,761 parts In-Stock

1+ parts

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3,761

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Digiode

USA . 2,388 parts In-Stock

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2,388

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Distributors (Availability)

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Andel Nordic

Denmark . 4,954 parts In-Stock

1+ parts

$8.080

100+ parts

-

1k+ parts

$7.757

10k+ parts

$7.757

4,954

$8.080

-

$7.757

$7.757

AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$11.462

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384

$11.462

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One Stop Electronics

USA . 1,178 parts In-Stock

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$13.000

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1,178

$13.000

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Parana Technologies

USA . 2,223 parts In-Stock

1+ parts

$26.793

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$28.661

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2,223

$26.793

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$28.661

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DigiPath Technology Company

USA . 1,982 parts In-Stock

1+ parts

$29.502

100+ parts

$27.142

1k+ parts

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1,982

$29.502

$27.142

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ChromeModa Solutions

Germany . 2,581 parts In-Stock

1+ parts

$30.104

100+ parts

$24.685

1k+ parts

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2,581

$30.104

$24.685

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IDEA Electronic Components Group

UK . 1,027 parts In-Stock

1+ parts

$30.104

100+ parts

$28.599

1k+ parts

$27.094

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1,027

$30.104

$28.599

$27.094

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Component Stockers USA

USA . 217 parts In-Stock

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$99.990

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217

$99.990

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Microchip USA

USA . 4,372 parts In-Stock

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Corphita

USA . 2,555 parts In-Stock

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Overview

Enhance your electronic projects with the SN74BCT573NSRG4 by Texas Instruments. This high-quality bus driver and transceiver is designed to deliver reliable performance in a wide range of applications. With Texas Instruments' reputation for excellence, you can trust that this product will exceed your expectations. Benefit from its 3-state output characteristics, true output polarity, and fast propagation delay of just 8.1 ns. Upgrade your designs with the SN74BCT573NSRG4 and experience the value and efficiency it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the bus driver & transceiver, making it suitable for various environments.

Propagation Delay At Nominal Supply: 9.6 ns

Low propagation delay ensures fast and efficient signal transmission, ideal for high-speed bus communication.

Surface Mount: YES

Being surface mountable makes the installation process easier and saves space on the PCB.

No. of Bits: 8

Suitable for applications requiring 8-bit data transmission or processing capability.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common 5V supply voltage, compatible with many standard systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps minimize signal distortion and maintain signal integrity.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate operation, offering flexibility in bus configurations.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, offering high speed and low power consumption.

Technical Specifications

Bus Driver & Transceivers SN74BCT573NSRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

Length:

12.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.6 ns

Propagation Delay (tpd):

8.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74BCT573NSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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