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SN74BCT573DWR

Texas Instruments

SN74BCT573DWR by Texas Instruments

SN74BCT573DWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.6ns at 5V, suitable for commercial-grade applications. It features a 3-STATE output, operates b/w 0-70°C, and has a max power supply current of 62mA. Ideal for driving buses in electronic systems requiring fast signal transmission.

Median Price

$1.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,000 parts In-Stock

1+ parts

$1.990

100+ parts

$1.950

1k+ parts

$1.910

10k+ parts

-

8,000

$1.990

$1.950

$1.910

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,903 parts In-Stock

1+ parts

$2.632

100+ parts

-

1k+ parts

-

10k+ parts

-

2,903

$2.632

-

-

-

Vyrian

USA . 7,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,875

-

-

-

-

DigiKey Marketplace

USA . 7,860 parts In-Stock

1+ parts

-

100+ parts

$2.750

1k+ parts

-

10k+ parts

-

7,860

-

$2.750

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,524 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

-

10k+ parts

-

3,524

$2.493

-

-

-

Andel Nordic

Denmark . 3,044 parts In-Stock

1+ parts

$8.464

100+ parts

-

1k+ parts

$8.125

10k+ parts

$8.125

3,044

$8.464

-

$8.125

$8.125

AZTECH Wire

Italy . 1,185 parts In-Stock

1+ parts

$12.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,185

$12.380

-

-

-

Parana Technologies

USA . 721 parts In-Stock

1+ parts

$14.162

100+ parts

$1,315.127

1k+ parts

$12.746

10k+ parts

-

721

$14.162

$1,315.127

$12.746

-

DigiPath Technology Company

USA . 249 parts In-Stock

1+ parts

$15.594

100+ parts

$14.346

1k+ parts

-

10k+ parts

-

249

$15.594

$14.346

-

-

ChromeModa Solutions

Germany . 1,867 parts In-Stock

1+ parts

$15.912

100+ parts

$13.048

1k+ parts

-

10k+ parts

-

1,867

$15.912

$13.048

-

-

IDEA Electronic Components Group

UK . 1,576 parts In-Stock

1+ parts

$15.912

100+ parts

$15.116

1k+ parts

$14.321

10k+ parts

-

1,576

$15.912

$15.116

$14.321

-

Microchip USA

USA . 2,032 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,032

-

-

-

-

Overview

Enhance the efficiency and reliability of your electronic systems with the SN74BCT573DWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Bus Driver & Transceivers for a wide range of applications. This product offers customers the value of fast propagation delay, 3-STATE output characteristics, and a compact design for seamless integration into your projects. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference with the SN74BCT573DWR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to environmental factors, making the product long-lasting.

Propagation Delay At Nominal Supply: 9.6 ns

Low propagation delay ensures fast signal transmission, improving overall performance of the bus driver.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on the circuit board.

No. of Bits: 8

Having 8 bits allows for a wide range of data transfer capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with most systems.

Load Capacitance (CL): 50 pF

A moderate load capacitance ensures stability in signal transmission.

Power Supplies (V): 5

Consistent power supply at 5V ensures reliable operation.

No. of Terminals: 20

Having 20 terminals allows for multiple connections, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board.

Maximum I (ol): 64 Amp

High maximum output current capability enables the product to drive heavy loads.

Propagation Delay (tpd): 8.1 ns

Low propagation delay ensures fast signal transmission, improving overall performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable operation in various environments.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the output signal, enhancing functionality.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures operation in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides good conductivity and corrosion resistance, ensuring longevity.

Terminal Position: DUAL

Dual terminal position allows for easy connectivity and installation.

No. of Ports: 2

Having 2 ports enables connection to multiple devices simultaneously.

Maximum Seated Height: 2.65 mm

Low seated height saves space in the overall system design.

Width: 7.5 mm

Compact width allows for easy integration into the circuit board layout.

Output Polarity: TRUE

Output polarity is true, ensuring correct signal transmission.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage ensures compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

High maximum time at peak reflow temperature allows for reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component reliability.

Length: 12.8 mm

Compact length allows for efficient use of space on the circuit board.

Temperature Grade: COMMERCIAL

Commercial-grade temperature tolerance makes the product suitable for standard operating conditions.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS technologies, providing high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and strong mechanical connection.

Packing Method: TR

TR (Tape and Reel) packing method allows for efficient automated assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy connection on the circuit board.

Control Type: ENABLE LOW/HIGH

Enable control with both low and high signals provides flexibility in operation.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage ensures safe operation within specified limits.

Maximum Power Supply Current (ICC): 62 mA

Moderate power supply current ensures efficient operation without drawing excessive power.

Technical Specifications

Bus Driver & Transceivers SN74BCT573DWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Control Type:

ENABLE LOW/HIGH

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay At Nominal Supply:

9.6 ns

Propagation Delay (tpd):

8.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74BCT573DWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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