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SN74BCT541ADBR

Texas Instruments

SN74BCT541ADBR by Texas Instruments

SN74BCT541ADBR by Texas Instruments is an 8-bit bus driver with a propagation delay of 8.2 ns at 5V, suitable for commercial applications. It features a small outline package with dual terminals and true output polarity, making it ideal for systems requiring fast signal transmission and low power consumption.

Median Price

$2.038

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,396 parts In-Stock

1+ parts

-

100+ parts

$1.820

1k+ parts

$1.630

10k+ parts

$1.540

5,396

-

$1.820

$1.630

$1.540

DigiKey

USA . 5,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.400

10k+ parts

-

5,396

-

-

$2.400

-

Verical

USA . 5,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.038

10k+ parts

$1.925

5,396

-

-

$2.038

$1.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 883 parts In-Stock

1+ parts

$1.919

100+ parts

-

1k+ parts

-

10k+ parts

-

883

$1.919

-

-

-

DigiKey Marketplace

USA . 5,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,650

-

-

-

-

Vyrian

USA . 3,281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,281

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,106 parts In-Stock

1+ parts

$1.818

100+ parts

-

1k+ parts

-

10k+ parts

-

2,106

$1.818

-

-

-

Andel Nordic

Denmark . 2,801 parts In-Stock

1+ parts

$3.676

100+ parts

-

1k+ parts

$3.529

10k+ parts

$3.529

2,801

$3.676

-

$3.529

$3.529

Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

$7.545

100+ parts

-

1k+ parts

$8.056

10k+ parts

-

1,670

$7.545

-

$8.056

-

DigiPath Technology Company

USA . 176 parts In-Stock

1+ parts

$8.308

100+ parts

$7.644

1k+ parts

-

10k+ parts

-

176

$8.308

$7.644

-

-

ChromeModa Solutions

Germany . 2,222 parts In-Stock

1+ parts

$8.478

100+ parts

$6.952

1k+ parts

-

10k+ parts

-

2,222

$8.478

$6.952

-

-

IDEA Electronic Components Group

UK . 135 parts In-Stock

1+ parts

$8.478

100+ parts

$8.054

1k+ parts

$7.630

10k+ parts

-

135

$8.478

$8.054

$7.630

-

A-Z Elektronik GmbH

Germany . 2,807 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,807

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-

-

-

Microchip USA

USA . 1,245 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,245

-

-

-

-

Overview

Enhance your electronic designs with the SN74BCT541ADBR from Texas Instruments, a renowned manufacturer known for top-quality products. This bus driver & transceiver offers fast propagation delay and 3-STATE output characteristics, making it ideal for various applications. With a small outline package and dual terminal position, this product maximizes space efficiency without compromising performance. Trust Texas Instruments to deliver reliable components that meet your needs for efficient signal transmission in your projects. Unlock the potential of your designs with the SN74BCT541ADBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, perfect for use in various environments.

Propagation Delay At Nominal Supply: 8.2 ns

Low propagation delay ensures fast and efficient signal transmission, ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes installation easy and saves space on the PCB, enabling efficient design layouts.

No. of Bits: 8

8 bits provide sufficient data transmission capacity for a wide range of bus driver applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage makes the product compatible with standard electronic systems and power sources.

Output Characteristics: 3-STATE

3-state output allows for high flexibility in controlling the bus driver and transceiver, offering multiple signal states.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and ensure reliable performance.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, providing high speed, low power consumption, and strong output drive capabilities.

Technical Specifications

Bus Driver & Transceivers SN74BCT541ADBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

72 mA

Propagation Delay At Nominal Supply:

8.2 ns

Propagation Delay (tpd):

8.2 ns

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

5.3 mm

Trade Compliance

SN74BCT541ADBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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